Greatbatch Ltd.

Wilson Greatbatch Ltd.

Greatbach Ltd.

William C Thiebolt

Christine A Frysz

Keith W Seitz

Thomas Marzano

Robert A Stevenson

Dominick J Frustaci

Jason Woods

Xiaohong Tang

Richard L Brendel

Steven W Winn

Esther S Takeuchi

Robert S Rubino

Buehl E Truex

Mark J Roy

Marcus J Palazzo

Joseph M Lehnes

Ho-Chul Yun

Warren S Dabney

Robert Shawn Johnson

Christopher Michael Williams

Jason T Hahl

William M Paulot

John E Roberts

Donald F Kaiser

Joseph M Probst

Douglas P Eberhard

Donald H Hickel, Jr

Jeffrey C Grisante

Jonathan Calamel

Brian D Panzer

Dominck J Frustaci

Thomas Shi

Bruehl E Truex

Ricahrd L Brendel

Donald Hickel

A current collector for an electrochemical cell is described. Unlike conventional current collector designs, the current collector does not have an unperforated perimeter frame completely bordering or surrounding a perforated interior region. Instead, only that portion of the current collector adjacent to the connector tab is unperforated. Otherwise, perforations extend directly to the perimeter edge.

Foil-type current collector having an unperforated strip at the connector tab

A lithium electrochemical cell with increased energy density is described. The electrochemical cell comprises an improved sandwich cathode design with a second cathode active material of a relatively high energy density but of a relatively low rate capability sandwiched between two current collectors and with a first cathode active material having a relatively low energy density but of a relatively high rate capability in contact with the opposite sides of the two current collectors. In addition, a cathode fabrication process is described that increases manufacturing efficiency. The cathode fabrication process comprises a process in which first and second cathode active materials are directly applied to opposite surfaces of a perforated current collector and laminated together. The present cathode design is useful for powering an implantable medical device requiring a high rate discharge application.

Sandwich cathode lithium battery with high energy density

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400&#xb0; C. to about 700&#xb0; C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400&#xb0; C. to about 1,900&#xb0; C. for up to 6 hours; and a cool down portion at a rate of up to 5&#xb0;/minute from a maximum sintering temperature down to about 1,000&#xb0; C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device

Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

Flexible hermetic membranes with electrically conducting vias

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

An electrolytic capacitor comprising an anode comprised of cryogenically milled anode material is described. The cryogenic milling process prepares the active anode material for anode fabrication. The capacitor further comprises a casing of first and second casing members secured to each other to provide an enclosure. A feedthrough electrically insulated from the casing and from the casing and extending there from through a glass-to-metal seal, at least one anode electrically connected within the casing, a cathode, and an electrolyte. The cathode is of a cathode active material deposited on planar faces of the first and second casing members.

Cryogenic grinding of tantalum for use in capacitor manufacture

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device

A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.

Shielded three-terminal flat-through EMI/energy dissipating filter with co-fired hermetically sealed feedthrough

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device

Growing community of inventors

Tonawanda, NY, United States of America

William C Thiebolt