Motorola Corporation

William C Roman

Carl J Raleigh

Gregory L Williams

A semiconductor device having a heat spreading layer (,) of material deposited by flame spraying on a back surface of the semiconductor die (,). The semiconductor die (,) has a thermal coefficient of expansion substantially similar to the thermal coefficient of expansion of the flame sprayed material. The flame sprayed material may be deposited directly on the semiconductor die (,) or on a backmetal layer (,). The heat spreading layer (,) is suitable for affixing the semiconductor die (,) to a metal substrate (,).

Semiconductor device with flame sprayed heat spreading layer and method

A cellular motor control network including a service center and a plurality of local cell controllers in communication with the service center, with each of the plurality of local cell controllers having a plurality of cellular motor controls in communication therewith. Each cellular motor control coupled to a variable speed electric motor. The cellular motor control including control circuits for controlling the operation of the variable speed electric motor, a microprocessor coupled to the control circuits for providing a predetermined control program, and a transceiver coupled to the microprocessor for communicating information between the microprocessor and other control units in the network.

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Tempe, AZ, United States of America

William C Roman