Motorola Corporation

Semi, Inc.

Sgs Semiconductor Corporation

William C Dunn

Ljubisa Ristic

Raymond Mervin Roop

Bertrand Francis Cambou

Lewis E Terry

Paul T Bennett

Ronald J Gutteridge

H Ming Liaw

Philip W McEntarfer

David H Soo

Brooks L Scofield, Jr

Wu Koucheng

Michael F Calaway

Stuart T Langley

A Magnetoresistive Random Access Memory (MRAM) device (10) and a method for manufacturing the MRAM device (10). The MRAM device (10) has a plurality of pairs of sense lines (21A, 21B, 22A, 22B, 23A, 23B, 24A, 24B), a plurality of pairs of memory cells (51A, 51B), and a plurality of word lines (31, 32, 33, 34). For two adjacent sense lines (21A, 22A), a first end of the first sense line (21A) is placed adjacent to a second end of the second sense line (22A) and a second end of the first sense line (21A) is placed adjacent to a first end of the second sense line (22A). Decoding transistors (82, 83, 84, 85, 86, 87, 88, 89) are connected to the second ends of the plurality of pairs of sense lines (21A, 21B, 22A, 22B, 23A, 23B, 24A, 24B).

Magnetoresistive random access memory device and method of manufacture

A rotor affixed to a central mounting post by helical springs for oscillatory rotary movement about the post. The post defining a Z axis and the sensing capacitors adjacent the rotor defining X and Y axes. The rotor, helical springs and post being formed of polysilicon in a single emiconductor process step.

Rotational vibration gyroscope

An environmental sensor integrated with high current drive device is provided. An environmental sensor is fabricated on a semiconductor substrate using conventional MOS process used for N-well CMOS logic and DMOS power transistors. An N-well is preferably used as a junction etch stop for micromachining of mechanical sensor components. A high voltage P-type region is used to electrically isolate the high current device from the sensor device. By locating the sensor device away from the high current drive device on a common semiconductor substrate, good performance can be achieved from the sensor even while the high current device dissipates a large amount of power.

Integrated circuit for sensing an environmental condition and producing

A three axis accelerometer includes a semiconductor substrate with a plurality of layers of conductive material formed thereon by semiconductor manufacturing techniques, with each layer defining a plane and mounted in parallel spaced relation to each other. A first of the layers is fixedly mounted and a second layer is mounted for limited movement relative to the first layer with the first and second layers forming a first capacitance varying in accordance with acceleration of the accelerometer along a first axis defined by the first and second layers. A plurality of first surfaces and a plurality of electrically isolated plates are formed as a portion of the first and the second layers, respectively, and positioned in parallel juxtaposition, with the plates being moveable relative to the first layer. The first surfaces and the plates defining mutually orthogonal second and third axes with each other and the first axis and forming capacitances which vary in accordance with acceleration in the second and third axes.

Three axes accelerometer

A rotor affixed to a central mounting post by helical springs for oscillatory rotary movement about the post. The post defining a Z axis and the sensing capacitors adjacent the rotor defining X and Y axes. The rotor, helical springs and post being formed of polysilicon in a single semiconductor process step,

A vibration gyroscope with a mass mounted for vibrational movement on a central post. Sensing capacitors are mounted adjacent the mass for sensing vibrational movement in two perpendicular axes. The mass includes a pair of elements mounted between the parallel arms of an H shaped frame and powered for equal and opposite vibrations so that no movement is imparted to the frame except that caused by forces induced by rotational movement.

Multi-axes gyroscope

A vibration gyroscope including a central mounting post and a planar mass symmetrically affixed thereto for vibrational movement. The post and mass are formed from a single layer of semiconductor material deposited on a substrate, such as silicon. Capacitive plates positioned below and above the mass, formed by depositing two additional layers of semiconductor material, are utilized for driving the mass and sensing vibration produced by the Coriolis effect.

Vibration monolithic gyroscope

A multi-axes gyroscope, a single axis gyroscope and a three axis accelerometer are formed on a single semiconductor substrate, along with and MPU. The gyroscopes provide sensing for rotation about three mutually orthogonal axes and the accelerometer provides sensing of acceleration along the three axes. The MPU controls and drives the gyroscopes and accelerometer and provides a continuous indication of position.

Integrated monolithic gyroscopes/accelerometers with logic circuits

A microprocessor having a monolithically integrated environmental sensor is provided. The microprocessor is shielded from an environmental signal by isolation which is specific to the type of sensor used, thereby allowing the sensor to be exposed to the environmental signal. Optionally, high current drive circuitry is integrated with the microprocessor-sensor circuit to provide a monolithic device which allows control of power loads based in part on output from an environmental sensing device.

Microprocessor having environmental sensing capability

A structure is provided to integrate bulk structure resonators into a monolithic integrated circuit chip. The chip also contains the remaining circuit components (17, 21, 24) required for the desired system function. Micromachining techniques are used to fabricate both support and a cavity (11, 27, 28) which allows mechanical vibration without interference. Alternative embodiments incorporate the use of non-piezoelectric mechanical resonators (14), quartz crystal resonators (18) and thin film piezoelectric resonators (22). Each type of resonator is used for the range of frequencies to which it is suited, providing a family of monolithic resonators capable of being used with integrated circuits having operating frequencies from a few hundred hertz to over 500 Mhz.

Monolithic circuit with integrated bulk structure resonator

An accelerometer in which the seismic mass is formed in the shape of an annulus. The annular shape allows twisting motions as well as displacement of the seismic mass to be sensed and restoring electrostatic forces applied. This allows the supporting spring to be made extremely weak avoiding the mechanical limitations of springs.

Accelerometer utilizing an annular mass

A method of joining an integrated circuit die (10) and a sensor die (11) by the use of solder bumps (12) for the formation of a hybrid circuit assembly. Sensor die (11) and integrated circuit die (10) are manufactured separately from each other. These two components are then joined by at least one solder bump to make a hybrid circuit assembly. A dielectric sealant (21) is deposited around the outside edges of sensor (11) to prevent foreign material such as encapsulating material from interfering in the operation of the sensor. The hybrid circuit assembly is encapsulated in a plastic material (14).

Method of bump bonding and sealing an accelerometer chip onto an

A differential capacitor structure includes a first static conductive layer and a second static conductive layer not electrically coupled to the first static conductive layer. A dynamic conductive layer is suspended between the first and second static conductive layers.

Differential capacitor structure and method

A monolithic diffraction spectrometer having a diffraction grating formed over a light sensing array is provided. The diffraction grating serves to diffract wavelengths of interest to an underlying photosensitive device while diffracting other wavelengths away from the photosensing element. By forming a diffraction grating with a variable pitch, or multiple diffraction gratings having various pitches, any number of specific light wavelengths can be detected with a high degree of precision. When a diffraction grating having a pitch which is in the order of the incident wavelength of light is used, improved sensitivity is achieved.

Monolithic diffraction spectrometer

A lamp intensity control system combines the functions of the tail light, the brake light, and the turn indicator light signals into one signal for controlling a plurality of lamps in an automobile. The tail light, brake light and turn indicator light signals are combined into one signal and modulated wherein the percent of modulation determines the intensity of the brightness of the plurality of lamps. Temperature protection is provided wherein a temperature limit circuit monitors the temperature of a SENSFET and disables the SENSFET if its temperature exceeds a predetermined magnitude. Over-current and open lamp conditions are monitored by comparator circuits. An over-current condition causes the SENSFET to be disabled. An over-temperature, over-current or open-lamp condition is signaled by a fault output signal.

Growing community of inventors

Mesa, AZ, United States of America

William C Dunn