Rogers Corporation

William Blasius

Kristi Dhimiter Pance

Stephen O'Connor

Karl Edward Sprentall

Gianni Taraschi

Dirk M Baars

Roshin Rose George

Christopher Brown

Murali Sethumadhavan

Bruce B Fitts

Michael S White

Michael Lunt

Sam Henson

John Dobrick

Shawn P Williams

Allen F Horn, Iii

Trevor Polidore

Sergio Clavijo

Shailesh Pandey

Jared Kenneth Spink

Jared DuPerre

An electromagnetic, EM, device, includes: a three-dimensional, 3D, body having a dielectric material, the 3D body having a first dielectric portion, 1DP, and a second dielectric portion, 2DP, wherein the 1DP is at least partially but not completely embedded within the 2DP; wherein the 1DP and the 2DP each have a dielectric material other than air; wherein the 1DP and the 2DP each have a planar cross-section profile perpendicular to a particular linear axis of the 3D body that is constant along the particular linear axis; wherein at least a portion of the 3D body is a dielectric resonator, DR.

Electromagnetic device and method of making same

A cured, shaped dielectric component, including a crosslinked product of a composite comprising a thermoplastic polymer, an optional crosslinking co-agent, an optional cure initiator, an optional additive composition, and a ceramic filler composition; wherein the cured, shaped dielectric component has a permittivity of 1.1 to 20 at 10 GHz; and wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.

Shaped dielectric component cross-linked via irradiation and method of making thereof

A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.

Dielectric electromagnetic structure and method of making the same

An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Electromagnetic dielectric structure adhered to a substrate and methods of making the same

In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.

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Charlton, MA, United States of America

William Blasius