Motorola Corporation

William B Mullen, Iii

Glenn F Urbish

Kingshuk Banerji

Anthony B Suppelsa

Robert W Pennisi

Rudy Yorio

Andrzej T Guzik

Edwin L Bradley, Iii

Dale W Dorinski

Vahid Kazem-Goudarzi

Adolph C Naujoks

Sivakumar Muthuswamy

Steven Duane Pratt

Charles W Mooney

Barry M Miles

Douglas W Hendricks

Henry F Liebman

Kenneth R Thompson

Richard A Ceraldi

Scott G Potter

Fadia Nounou

Bruce J Freyman

Danny E Ross

Leonard F Altman

William M Bradford

Jill L Flaugher

David L Ellis, Ii

Kenneth M Wasko

Virgil F Kuhl

Francisco Da Costa Alves

Robert Henschel

Glenn E Gold

Robert W Shisler

John M Nickelsen, Jr

James H Grotelueschen

James E Van Hout

Lamar Q Williams

Raymond C Vivian, Jr

Robert S Hall

A piezoelectric active-mode incrementor switch system (,) includes two ratchet wheels (,) that are rotationally mounted on a drive shaft (,) having a knob (,). The ratchet wheels (,) form a slipping clutch with their respective drive wheels (,) which are rigidly mounted to the drive shaft and mechanically loaded with spring (,). The ratchet wheels (,) are mounted inversely to each other on the drive shaft (,) and make contact with their respective cantilever beams (,) which each have a piezoelectric film. In operation, the switch (,) functions by mechanically stimulating the piezoelectric beams. When the knob (,) is rotated in one direction, only one of the beams (,) is displaced causing a generation of an electrical charge that acts as a signal. The other beam (,or,) is prevented from moving and therefore its beam does not produce a signal. When the knob (,) is rotated in the opposite direction, the other beam that was previously prevented from moving is displaced causing an electrical signal to be generated by the switch.

Switch system

An integrated circuit package (,) comprises a semiconductor die (,), and a substrate (,) for receiving the semiconductor die. The substrate has an aperture(s) (,) below the semiconductor die for providing moisture relief during temperature excursions. The semiconductor die is wirebonded to the substrate. An encapsulant (,) seals the top surface of the semiconductor die and serves to bond the semiconductor die to the substrate. The encapsulant also covers portions of the top side of the substrate.

Moisture enhanced ball grid array package

A piezoelectric switch (10) is made by laminating one piezoelectric film (16) on the top and a second piezoelectric film (18) on the bottom sides of a stiff central core (14). The central core has one or more actuation areas or poppels (12) formed therein. Each piezoelectric film has an electrically conductive portion (15, 17) formed directly over the actuating area. When the actuating area on the laminate is depressed (11), the piezoelectric films each generate an electric signal that is sent through the electrically conductive portions, thus creating a switching signal.

Piezoelectric switch

A frequency domain switch (100) utilizes an array of cantilevered beams (108) laminated with a piezoelectric material (126). Each of the beams has a unique geometry, and produces a sinusoidal electrical signal in the piezoelectric film that is assignable only to one of the cantilevered beams. When a free end of one of the cantilevered beams is deflected, it produces a signal that is analyzed by suitable circuitry (410-440) to read the position of the switch.

Switching method using a frequency domain piezoelectric switch

A control switch for a radio is formed using an electro-mechanical assembly (400) which includes an array of cantilevered beams (402) laminated with piezoelectric film. A movable surface (404) includes protrusions (406) positioned to deflect the cantilevered beams and generate pulsed signals in a coded manner. Electronic circuitry (410) stores the pulsed signals and associates the signals with a position of the switch.

Piezoelectric switch apparatus for a communication device

A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

Solderless electrical interconnection including metallized hook and loop

An automated method of predicting the number of defects that will occur during the manufacturing of a new electronic assembly design on a specific assembly line. Defective components are counted (214) as they are manufactured on an assembly line (210). The counted defects are stored in a historical database (220) and the defect rate is calculated. A bill of material for the new electronic design (230) is enumerated and information associated with each component is extracted from a library database (240) into a quality forecasting engine (250). The quality forecasting engine imports the enumerated bill of material and imports the stored defect rate from the historical database to perform a calculation of a predicted number of defects (260) for said new electronic assembly using the extracted library information.

Quality forecasting engine

A one-way optical communication system adapted for vehicular use. A light-readable indicia (35) is embedded in a window or mounted on an exterior portion of a moving motor vehicle (10). The indicia (15) is transparent to visible light and is reflective to infrared or ultraviolet light, making it generally invisible to the unaided human eye. A beam (30) of infrared or ultraviolet light located in a fixed position remote from the moving vehicle illuminates the indicia and portions of the beam are reflected from the illuminated indicia in a representative pattern. The reflected beam is detected by a fixed sensor (25), which provides an electrical signal. The signal is analyzed to determine the identity of the motor vehicle.

One-way optical highway communication system

A multipoint electrical interconnection (10) provides a plurality of electrical pathways between electrically conductive hooks (15) on a substrate (12) and an electrical component (50). A plurality of electrically conductive hooks generally formed in the shape of a `J` have a head portion (20) affixed to the substrate such that a hook portion (17) protrudes above the substrate. An electrically conductive portion of a component is disposed against the substrate such that it contacts at least three of the electrically conductive hooks and deforms the hooks. The deformed hooks provide a spring force to effect a multipoint electrical connection.

Multipoint electrical interconnection having deformable J-hooks

A solder clad printed circuit board (100) consists of an electrically insulating substrate that has copper circuit traces (105), portions of which are solderable. A substantially planar layer (120) of a soldering composition is fused to the solderable traces, to form a solder pad that is not domed. The layer is composed of a mass of off-eutectic solder particles (115) that are fused together to form an agglomeration (120) having a porous structure. The solder particles are fused together by heating the off-eutectic solder to a temperature that is between the solidus temperature and the liquidus temperature of the solder. The solder is then cooled below the solidus temperature to solidify it.

Single alloy solder clad substrate

A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second temperature, the second temperature being greater than the first temperature. The soldering composition is deposited (20) on a substrate (100) having solderable portions (105) and is heated to a temperature that is above the first temperature but below the second temperature (32). During this time, the first solder alloy liquifies, while the second solder alloy remains solid. The soldering composition is subsequently cooled (40) to solidify the first solder material. A part or electronic component is added (80) to the solidified solder material and the solder materials is again heated above the second temperature (30) in order to reflow the solder and form a metallurgical bond between the substrate and the electronic component.

Soldering process

A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second copper pattern (14) is plated with a metallic material to form wire bondable areas (18) on the second copper pattern (14), however, the first copper pattern (12) is substantially devoid of the metallic material. A device (21) is wire bonded to the wire bondable areas (18) of the second copper pattern (14), and a protective covering (23) covers the wire bondable areas (18).

Chip carrier having copper pattern plated with gold on one surface and

A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (26) carrying with them a predetermined amount of tacking agent. The pins are then contacted (27) to the printed circuit board and removed (28). During this process, a predetermined amount of tacking agent is deposited at selective locations on the printed circuit board. A component is placed (30) on the printed circuit board in the tacking agent and the circuit board and component are heated (40) in order to reflow the solder and effect the solder joint between the component and the board.

A solder preform (250) has solder particles of one alloy (210) arranged within a matrix of a second solder alloy (200). This arrangement forms a structure having the desired predetermined shape of the solder preform. The solder particles comprise one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The particles have a predetermined melting temperature. The second solder alloy is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight of the solder preform, and the second solder alloy comprises about 12% by weight of the preform.

Multiple alloy solder preform

A selectively releasing runner and substrate assembly (10) comprises a plurality of conductive runners (16) adhered to a substrate (12). A portion (18) of at least some of the conductive runners have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to thermal stress. The selectively releasing runner and substrate assembly is made by selectively depositing an adhesion layer (14) of a first metal to portions of the surface of the substrate where maximum adhesion is desired. The other portions of the substrate are not covered with the first metal. The first metal layer and the uncovered portions of the substrate surface are covered with a second metal layer (16). The adhesion of the second metal layer to the substrate is less than the adhesion of the second metal layer to the first metal layer, and less than the adhesion of the first metal layer tot he substrate. The second metal layer may be copper. Additionally, an electronic component (22), such as an integrated circuit, may be attached to the selectively releasing metal portion.

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Boca Raton, FL, United States of America

William B Mullen, Iii