Eastman-kodak Company

William B Jones

Wilbert F Janson, Jr

Gary A Hallenbeck

Lee R Estelle

John D Griffith

Stephen P Smith

Nicholas Sztanko

A reverse Galilean finder in which a front frame, preferably associated with a front element is projected away from the eye by the finder optics without separate frame projection optics to a position such that the distance between the apparent position of the frame to the eye and the rear vertex of the finder divided by the length of the finder is at least 2.2.

Reverse Galilean finder with projected front window

The system of the present invention increases the resolution of an image that may be formed from an image sensor without increasing the resolution of the sensor. An image beam is directed along a path through a color filter wheel and a single non-rotating transparent plate and impinges on a CCD (Charge Coupled Device). A cam body with an angled surface rotates about the optical axis of the image beam and tilts the transparent plate in a plurality of discrete sampling positions. At each sampling position, the tilted transparent plate displaces the image beam in a different direction. Therefore, each pixel of the CCD samples a plurality of areas of the image. The color wheel is rotated to sequentially place each filter into the path of the image beam. The CCD sequentially receives the light passed through the transparent plate and color filter wheel and converts the image formed by the light to corresponding electrical signals. The electrical signals are stored and reordered by interleaving to form an image with increased resolution.

Cam actuated optical offset image sampling system

An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical element. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.

Method of manufacturing an optoelectronic device package

An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical elements. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.

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Rochester, NY, United States of America

William B Jones