Lattice Semiconductor Corporation

William B Andrews

John Schadt

Mou C Lin

Harold Scholz

Fulong Zhang

Phillip Johnson

Barry Britton

Larry Fenstermaker

Zheng Chen

Arifur Rahman

Ming Hui Ding

Anthony K Myers

John P Fishburn

Gregory S Cartney

Gary P Powell

David A Rhein

Warren L Ziegenfus

Alfred E Dunlop

Keith Truong

Zheng (Jeff) Chen

Ravi Lall

Xiaotao Chen

Zhen Chen

Hal Scholz

In one embodiment of the invention, a programmable logic device, such as an FPGA, has programmable I/O circuits that can be programmed into any one of a number of different operating modes before configuration is completed. As such, the same set of I/O circuits and corresponding I/O pads can be used to configure the device using different configuration interfaces having different interface signaling requirements. Such a device may be able to be implemented using fewer I/O pads than conventional devices that employ a different set of I/O pads for each different type of configuration interface supported by the device.

Pre-configuration programmability of I/O circuitry

In one embodiment of the invention, a programmable device, such as an FPGA, has a programmable input buffer with a VCCIO-powered buffer stage for high-voltage signaling and a VCC-powered buffer stage for low-voltage signaling. In addition to a main driver section, the VCCIO-powered buffer stage has a mixed-mode section for handling multiple different over-drive and multiple different under-drive conditions, a hysteresis section for providing multiple different trip-point hysteresis modes of operation, and a level-shifting section with look-ahead circuitry that enables the main driver section to be implemented with low-power, high-threshold devices, while still enabling the VCCIO-powered buffer stage to operate with low skew and high speed.

Programmable buffer

A flexible delay cell architecture and related methods are provided that may be used, for example, with input/output (I/O) blocks of a programmable logic device (PLD). In one implementation, a PLD includes a delay cell comprising a plurality of delay elements. The delay elements are adapted to delay an input signal to provide an output signal according to a delay setting corresponding to a number of the delay elements. The PLD also includes a register adapted to store the delay setting. The PLD further includes an edge monitor adapted to signal whether an edge transition of the output signal has occurred during a time window. In addition, the PLD includes logic adapted to adjust the delay setting stored by the register in response to the edge monitor signaling the edge transition.

Flexible delay cell architecture

In one embodiment of the invention, a receiver has two mux circuits, two receiver circuits, and a mixer. The muxes select first and second input signals for the receiver circuits. A p-type transistor in a transmission gate in each mux is connected (i) at its channel nodes between a pad and the mux output and (ii) to receive a control signal at its gate node. Control circuitry for the p-type transistor implements a threshold reduction filter that ensures that a maximum voltage level at the mux output is at least a threshold below the mux's power supply voltage. Based on first and second input signals, the first receiver circuit generates first and second intermediate signals, and the second receiver circuit generates third and fourth intermediate signals. The mixer circuit combines the intermediate signals to generate first and second output signals, wherein the first and second receiver circuits effectively operate over different ranges of common-mode voltages.

Receiver for differential and reference voltage signaling with programmable common mode

In one embodiment, an integrated circuit, such as an FPGA, has one or more programmable termination schemes, each having a plurality of resistive termination legs connected in parallel, and a calibration circuit designed to control each termination scheme for process, voltage, and temperature (PVT) variations. A sense element in the calibration circuit and each resistive leg in each termination scheme has a transistor-based transmission gate connected in series with a non-silicided poly (NSP) resistor. The negative temperature coefficient of resistivity of each NSP resistor offsets the positive temperature coefficient of resistivity of the corresponding transmission gate to provide a temperature-independent sense element and temperature-independent termination legs. The temperature-independence and constant IV characteristic of the sense element and termination legs enable a single calibration circuit to simultaneously control multiple termination schemes operating at different termination voltage levels.

Temperature-independent, linear on-chip termination resistance

In one embodiment of the invention, a bias signal monitor has two signal comparators that compare two (power supply) voltages at two different bias points and a logic circuit that processes the outputs from the two signal monitors to generate a bias signal monitor output signal. The logic circuit implements hysteresis-based processing such that (1) if both signal comparators are active (indicating that a first voltage is greater than the second voltage relative to both bias points), then the monitor output is active, (2) if both signal comparators are inactive (indicating that the first voltage is not greater than the second voltage relative to either bias point), then the monitor output is inactive, and (3) if one signal comparator is active and the other is inactive, then the monitor output keeps its previous value. This hysteresis characteristic prevents relatively small oscillations between the voltages from changing the monitor output.

Hysteresis-based processing for applications such as signal bias monitors

In one embodiment of the invention, a programmable level shifter can be selectively configured to operate in either a high-speed mode or a low-power mode. In both modes, the level shifter converts an input signal in one power supply domain into an output signal in another power supply domain. In the high-speed mode, p-type devices are configured as a current-mirror amplifier that provides the level shifter with relatively fast switching speed. In the low-power mode, the same p-type devices are configured as a cross-coupled latch that provides the level shifter with relatively low power consumption. Selectively enabled n-type devices provide the low-power mode with larger effective n-type devices to flip the cross-coupled latch formed by the p-type devices in the low-power mode.

Programmable level shifter

In one embodiment, an integrated circuit has configurable application circuitry that operates at any one of multiple available power supply voltages. PT-control circuitry, operating at a PT reference voltage, generates a PT-control signal indicative of variations in process and temperature. Application-control circuitry controls the configuration of the application circuitry based on the selected power supply voltage for the application circuitry and the PT-control signal, where the selected power supply voltage is independent of the PT reference voltage. In one implementation, the application circuitry is an output driver having source and sink driver blocks, where driver-control circuitry controls the configuration of the source driver block based on the selected output-driver power supply voltage, a source PT-control signal, and a selected drive strength, while controlling the configuration of the sink driver block based on the selected output-driver power supply voltage, a sink PT-control signal, and a selected drive strength.

Integrated circuit having independent voltage and process/temperature control

In one embodiment of the invention, an integrated device has interface circuitry that includes a dynamic monitor that monitors the relative potential between (at least) two different power supplies to enable the device to react to over-voltage conditions such that appropriate selections can be made for which power supplies are selected for different components in the interface circuitry, such as output drivers and input receivers. The dynamic monitor enables over-voltage protection to be automatically implemented before the device has been configured, such as during the device's power-on state.

Dynamic over-voltage protection scheme for interface circuitry

A buffer for a programmable logic device has programmable current sink and source circuitry and an independently programmable common-mode voltage reference source. An amplifier, responsive to a common-mode voltage detector and the voltage reference source, forces a common-mode voltage of an output signal from the buffer to approximate the voltage from the common-mode voltage reference source.

Programmable current output and common-mode voltage buffer

Receiver for differential and reference-voltage signaling with programmable common mode

In one embodiment of the invention, an integrated circuit, such as an FPGA, has one or more programmable termination schemes, each having a plurality of resistive termination legs connected in parallel, and a calibration circuit designed to control each termination scheme for process, voltage, and temperature (PVT) variations. The sense element in the calibration circuit and each resistive leg in each termination scheme has a transistor-based transmission gate connected in series with a non-silicided poly (NSP) resistor. The negative temperature coefficient of resistivity of each NSP resistor offsets the positive temperature coefficient of resistivity of the corresponding transmission gate to provide a temperature-independent sense element and temperature-independent termination legs. The temperature-independence and constant IV characteristic of the sense element and termination legs enable a single calibration circuit to simultaneously control multiple termination schemes operating at different termination voltage levels.

An improved output buffer having a digital output slew control and compensation for manufacturing process variations. Output slewing is accomplished by sequencing digital drive signals to paralleled output transistors. In one embodiment, a pre-driver sequences the drive signals by using the propagation delays of serially coupled digital logic gates to reduce power supply droop and/or ground bounce. The output transistors are turned off substantially simultaneously to avoid undesirable power supply DC current flow when the output buffer changes state. Programmably configuring the number of paralleled transistors that may be turned on at any given time allows a user to compensate for manufacturing process variations and determine the output impedance/drive capacity of the buffer.

Output buffer with digital slew control

In one embodiment of the invention, a programmable termination structure has first and second termination circuits for corresponding pads and a programmable connection therebetween. The first termination circuit supports first and second sets of termination schemes. A shared resistor is part of at least one termination scheme in each set. The first termination circuit supports a termination scheme between the first pad and a user-defined node connected to an on-chip capacitor such that first pad is connected via the termination scheme to the on-chip capacitor. Control circuitry automatically turns on and off a termination scheme for bidirectional signaling supported by the first termination circuit, wherein (1) the control circuitry turns off the termination scheme if an output buffer is configured to present outgoing signals at the first pad and (2) the control circuitry turns on the termination scheme if the output buffer is disabled in order to terminate incoming signals received at the first pad.

Programmable termination for single-ended and differential schemes

An integrated circuit having a transistor device and over-voltage protection circuitry. The transistor device is implemented in a technology having a specified operating-voltage range, the transistor device having gate, drain, source, and tub nodes, and the specified operating-voltage range having a specified maximum voltage. The over-voltage protection circuitry is adapted to apply gate and tub voltages to the gate and tub nodes, respectively. If at least one channel voltage applied to at least one of the drain and source nodes exceeds the specified maximum voltage, then the over-voltage protection circuitry controls at least one of the gate voltage and the tub voltage to inhibit one or more adverse effects to the transistor device.

Growing community of inventors

Emmaus, PA, United States of America

William B Andrews