Lucent Technologies Inc.

Agere Systems Optoelectronics Guardian Corp.

William Andrew Gault

Joseph Michael Freund

George John Przybylek

Dennis Mark Romero

John William Stayt, Jr

John M Geary

Mindaugas Fernand Dautartas

Scott Knutt

Ralph J Diehl, Jr

Educational grain-stuffed doll with wrist tag identifying type of grain visible through transparent chest window

An apparatus is provided for cleaving a laser bar into semiconductor chips. The apparatus includes a supporting structure on which a member slides. The apparatus also includes a pair of film layers. The laser bar is positioned between the film layers. A chamber is sealed to the top film layer. The chamber has an inlet through which gas is input. The movement of the member and the downward force caused by the buildup of gas pressure in the chamber induce cleaving of the laser bar at predetermined locations. The laser bar may have score marks at the predetermined locations to produce weak points. Pressure pulses may be coordinated with the movement of the member to break the laser bar at the desired locations.

Method and apparatus for handling laser bars

An apparatus and method for performing tests on laser chips that are not labor intensive and will not result in wasted parts should the laser chip fail the test is disclosed. A &ldquo;bare&rdquo; laser chip is subjected to a test in accordance with one embodiment by placing the laser chip on an insulating material with an embedded conducting contact through which the current to power the laser chip is passed. A cover plate provides a channel around the laser chip through which a jet of high pressure inert gas is passed to dissipate the self-heating of the laser chip that occurs during the test process. The laser chip is kept in place by physical pressure. In accordance with another embodiment, the temperature of the laser chip is measured and a thermoelectric cooler is used to cool the laser chip. The test on the &ldquo;bare&rdquo; laser chip eliminates the need to solder bond the laser chip to a carrier and attach wire bonds to the laser chip, thus reducing associated labor and parts costs.

Apparatus and method for testing semiconductor laser chips

A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a sealed chamber. The chamber has an inlet through which gas is input. A downward force caused by gas pressure in the chamber causes the cover membrane to contact the parts and presses the plurality of parts against the film. A heating device heats the film to cause the parts to adhere to the film.

System for adhering parts

An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.

Method and apparatus for non-contact pulsating jet cleaving of a

A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets. Moreover, there is no possibility that the devices will be displaced as a result of any air currents, since they are securely retained between the two film sheets.

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Mohnton, PA, United States of America

William Andrew Gault