Hughes Aircraft Company

William America

Enrique Garcia

Richard R Poole

A thinned backside illuminated charge-coupled imaging device has improved quantum efficiency by providing a sharp ion implant distribution profile (20) disposed at the rear surface (22) of the device. The sharp ion implant distribution profile (20) is formed using ion implantation at a beam energy potential of between 100-150 keV, which forms an electric field beneath the surface of the device. The ion distribution profile (20) is brought to the surface (22) of the device by removing silicon (18) from the rear surface (22), using a polishing technique wherein the device is lapped with colloidal silica abrasive to controllably remove silicon down to the level of the ion implantation profile (20).

Method for establishing an electrical field by thinning an implanted

Method for establishing an electrical field at a surface of a

A method for fabricating thinned, back-illuminated, solid state image sensors 10 includes steps of positively doping a bottom surface 22 of a top semiconductor wafer 24, and bonding the bottom surface 22 of the top semiconductor wafer 24 to a top surface 26 of a bottom semiconductor wafer 28 with a silicon dioxide passivation layer 34 in between. The top wafer 24 is thinned and an insulating layer of silicon dioxide 36 and a polysilicon gate structure 38 are formed thereover. Individual dies 40 are then formed, which are bonded to a substrate 42 along each pixel face. The bottom semiconductor wafer layer 28 is etched away to expose the silicon dioxide passivation layer 34, which acts to protect the thinned top wafer layer 24. The dies 40 are then etched to expose bonding pads within the gate structure 38, and sized to create thinned, back-illuminated, solid state image sensors 10.

Growing community of inventors

Newtown, CT, United States of America

William America