Other

Analog Devices,inc.

William A Webster

John R Martin

Maurice S Karpman

Lawrence E Felton

Peter Farrell

Jing Cheng Luo

Manolo G Mena

Elmer S Lacsamana

David J Collins

Michael P Duffy

A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

Method of producing a MEMS device

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

MEMS capping method and apparatus

Growing community of inventors

Tewksbury, MA, United States of America

William A Webster