Intel Corporation

William A Samaras

Michael P Brownell

Paul T Phillips

James G Maveety

David J Ayers

Dan R McCutchan

Richard Michael Ramirez

A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are then tested, and the interposer is coupled to a substrate with the solder balls for further assembly only if the test is passed.

Method of assembling a multi-chip device

In an embodiment of the present invention, an apparatus to eject a semiconductor package from a semiconductor package socket includes a package ejector coupled to a semiconductor package socket. The package ejector can include an ejector cam and be coupled to an upper surface of the semiconductor package socket.

Semiconductor package ejector

A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.

Multi-chip land grid array carrier

A power delivery system includes a circuit board, a power consuming module and a dc--dc converter. The printed circuit board has on it a first signal connector, a pair of first contacts to which a first voltage is supplied, spaced from said connector, and fasteners spaced from said pair of first contacts. The power consuming module has a second signal connector, mating with the first signal connector, and has respective upper and lower power pads for receiving low voltage power. The dc--dc converter converts the first voltage to a lower voltage. The dc--dc converter has a pair of second contacts contacting said pair of first contacts, surfaces mating with said fasteners and holding the converter on the printed circuit board such that said second contacts are in firm contact with said first contacts, and a laterally extending connector having upper and lower contacts supplying the lower voltage and engaging the upper and lower power pads of the power consuming module.

Growing community of inventors

San Jose, CA, United States of America

William A Samaras