Agere Systems Inc.

Other

William A Russell

Daniel Charles Kerr

Alan Sangone Chen

Amal Ma Hamad

Edward Paul Martin, Jr

Roscoe T Luce

Michele Marie Jamison

Roger W Key

Bradley J Albers

Bradley Curtis Deselms

Dennis P Biondi

Alan R Olds

A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity from the device to a substrate of the integrated circuit. In one embodiment a heat sink is affixed to the integrated circuit for heat flow from the integrated circuit. The method comprises forming openings in material layers overlying the semiconductor substrate, wherein the openings are disposed proximate the device and extend to the substrate. A thermally conductive material is formed in the openings to provide a thermal path from the device to the substrate.

Structure and method for improved heat conduction for semiconductor devices

A semiconductor manufacturing method comprises forming a leveling guard ring defining an interior area into which are fabricated one or more devices. In certain embodiments two or more matched devices, such as in a common centroid layout, are fabricated in the interior area. The guard ring is formed on at least one particular layer for a particular processing step. By the guard ring overwhelming the effect of local features' elevation differences, photoresist thereafter applied consequently has a more uniform height across the interior area, resulting in more uniform devices. In some embodiments, a plurality of guard rings enclosing respective arrays of matched devices are arranged over the surface of a semiconductor wafer, spaced apart so as to be not local to one another. Based on the equalizing effect by each of the guard rings, the respective devices arranged in the interior areas are more evenly matched to equivalent devices in far-spaced guard rings. Thus, both local and global matching are achieved.

Guard ring for improved matching

A semiconductor manufacturing method comprises forming a leveling guard ring defining an interior area into which are fabricated one or more devices. In certain aspects, two or more matched devices, such as in a common centroid layout, are fabricated in the interior area. The guard ring is formed on at least one particular layer for a particular processing step. By the guard ring overwhelming the effect of local features' elevation differences, photoresist thereafter applied consequently has a more uniform height across the interior area, resulting in more uniform devices. A plurality of guard rings may be used that enclose respective arrays of matched devices arranged over the surface of a semiconductor wafer. Based on the equalizing effect by each of the guard rings, the respective devices arranged in the interior areas are more evenly matched to equivalent devices in far-spaced guard rings. Thus, local and global matching are achieved.

A resistor formed on a material layer of a semiconductor integrated circuit and a method for forming the resistor. The resistor comprises a region of resistive material with a plurality of conductive contacts or plugs in electrical contact with and extending away from the resistive material. A first and a second interconnect line are formed overlying the plugs and in conductive contact with one or more of the plurality of plugs, such that a portion of the resistive material between the first and the second interconnect lines provides a desired resistance. According to a method of the present invention, the plurality of conductive contacts are formed using a first photolithographic mask and the first and the second interconnect lines are formed using a second photolithographic mask. The desired resistance is changed by modifying the first or the second mask such that one or more dimensions of a region of the resistive material between the first and the second interconnect lines is altered.

Structure and method for adjusting integrated circuit resistor value

Apparatus and method are provided for in-situ measurement of vibrational energy applied to a wafer in a process bath of a vibrational cleaning system. The apparatus may be made up of a test wafer comprising an array of pressure sensing elements disposed thereon for monitoring power level variation of a time-varying pressure wave. The time-varying pressure wave is indicative of vibrational energy that would be applied to a wafer in the process bath in the position of the test wafer.

Apparatus and method for in-situ measuring of vibrational energy in a process bath of a vibrational cleaning system

Parabolic listening device

A case within which record player records can be conveniently carried so that the records cannot be damaged while in transit, the case consisting of a container molded of plastic material and which is integral with several posts formed on one interior side wall so that the records can be hooked on to the posts, and the case, in one design of the invention, being reversible inside out so to form a stand with the posts on the outer side during use so to conveniently locate records that are desired to be played.

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Orlando, FL, United States of America

William A Russell