Efficere, Inc.

Morgan Miller Technologies LLC

William A Miller

Morgan T Johnson

A method of fabricating a conductive line provides a substrate having a blanket layer of conductive material disposed thereon, a removing of a first portion of the blanket layer of conductive material to form one or more gaps that define a first line, the gaps adjacent to the first line, the first line having at least a first segment of a first width and a second segment of a second width, the first and second widths being different, a first increasing of the width of a first gap of the one or more gaps, the first gap adjacent to the first segment, by a first amount, and a second increasing of the width of a second gap of the one or more gaps, the second gap adjacent to the second segment, by a second amount wherein the first and second increasing depend upon a desired electrical characteristic. The first amount and the second amount may be different from each other.

Variable width conductive lines having substantially constant impedance

An assembly has a conductive trace on a substrate and at least one conductor electrically coupled to the trace. First and second gaps arranged such that one gap is on either side the trace, allowing control of electrical characteristics of a signal path formed of the conductor and the trace.

Direct wire attach

A unified process of making an electrical structure includes performing a plurality of laser etching operations on a workpiece, without removing the workpiece from a laser processing system. The workpiece includes a conductive material disposed on an electrically insulating substrate, and the plurality of laser etching operations include, but are not limited to, two or more of forming a fiducial, forming thick metal traces separated by high aspect ratio spaces, cutting an alignment hole, cutting a folding line, and singulating the electrical structure. In another aspect of the invention, a database is prepared, and communicatively coupled to the laser processing system to provide control signals that direct a portion of the plurality of operations of the laser processing system, wherein each plurality of etching operations is defined with respect to a common coordinate system.

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Camas, WA, United States of America

William A Miller