Apple Inc.

William A Counts

Abhijeet Misra

James A Curran

Eric W Hamann

James A Yurko

Mikael M Silvanto

Dinesh C Mathew

John Raff

Keith J Hendren

Houtan R Farahani

Robert Y Cao

Marwan Rammah

Kevin M Robinson

Simon R Lancaster-Larocque

Matthew Theobald

Ari P Miller

Robert J Lockwood

Simon J Trivett

Antonio Clarke

Genie Kim

Francesco Ferretti

Gurshan Deol

Prabhu Sathyamurthy

Ian A Spraggs

Lee E Hooton

James A Wright

Zechariah D Feinberg

Herng-Jeng Jou

Brian M Gable

Karan Bir

Lei Gao

Steven J Osborne

Weiming Huang

David A Pakula

Michael Benjamin Wittenberg

Sawyer Isaac Cohen

Lucy Elizabeth Browning

Naoto Matsuyuki

Michael D Quinones

Robert F Meyer

Alexander W Williams

James A Bertin

Stoyan P Hristov

Nagarajan Kalyanasundaram

Eric W Bates

Jian Yang

Jeffrey Lee Mattlin

Hoishun Li

Jason P Shannon

Yoshihiko Yokoyama

Devon A Monaco

Andrew J Meschke

Bryan D Keen

Sina Bigdeli

Brian P Demers

Aaron D Paterson

Thomas Johannessen

Katie L Sassaman

Graeme W Paul

Rafael Yu

Anuj Datta Roy

Andrew W Meschke

Susannah P Calvin

Matthew S Theobald

Techniques for making glass components for electronic devices are disclosed. The techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. The techniques may involve reshaping the glass workpiece, fusing glass layers of the workpiece, or combinations of these. Glass components and electronic devices including these components are also disclosed.

Forming and bonding of glass components for portable electronic devices

An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.

Multi-part device enclosure

A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

Core shell with various filler materials for enhanced thermal conductivity

An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

Support plate thin cladding

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Electronic device having a composite structure

The disclosure provides an aluminized composite including a base material. The aluminized composite may also include a diffusion layer disposed over the base material. The aluminized composite may further include an aluminum material disposed over the diffusion layer.

Coloring of metallic materials coated with aluminum

The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Recycled aluminum alloys from manufacturing scrap with cosmetic appeal

A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600&#xb0; C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

Mold materials for formed ceramic

Anodic oxide coatings and methods for forming anodic oxide coatings on metal alloy substrates are disclosed. Methods involve post-anodizing processes that improve the appearance of the anodic oxide coating or increase the strength of the underlying metal alloy substrates. In some embodiments, a diffusion promoting process is used to promote diffusion of one or more types of alloying elements enriched at an interface between the anodic oxide coating and the metal alloy substrate away from the interface. The diffusion promoting process can increase an adhesion strength of the anodic oxide film to the metal alloy substrate and reduce an amount of discoloration due to the enriched alloying elements. In some embodiments, a post-anodizing age hardening process is used to increase the strength of the metal alloy substrate and to improve cosmetics of the anodic oxide coatings.

Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys

This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Cladded metal structures for dissipation of heat in a portable electronic device

This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

Thermally conductive structure for dissipating heat in a portable electronic device

A process is disclosed for minimizing the difference in thermal expansivity between a porous anodic oxide coating and its corresponding substrate metal, so as to allow heat treatments or high temperature exposure of the anodic oxide without thermally induced crazing. A second phase of higher thermal expansivity than that of the oxide material is incorporated into the pores of the oxide in sufficient quantity to raise the coating's thermal expansion coefficient. The difference in thermal expansion between the anodic oxide coating and underlying metal substrate is reduced to a level such that thermal exposure is insufficient for any cracking to result. The second phase may be an electrodeposited metal, or an electrophoretically deposited polymer. The second phase may be uniformly deposited to a certain depth, or may be deposited at varying amounts among the pores.

Anodic oxide based composite coatings of augmented thermal expansivity to eliminate thermally induced crazing

Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.

Portable electronic device

Growing community of inventors

Sunnyvale, CA, United States of America

William A Counts