Carl Zeiss Smt Gmbh

Carl-zeiss-smt Ag

Willi Heintel

Harald Kirchner

Hagen Federau

Yim-Bun Patrick Kwan

Bernhard Geuppert

Joachim Hartjes

Andreas Frommeyer

Wolfgang Keller

Markus Deguenther

Michael Patra

Jens Kugler

Bernhard Gellrich

Ulrich Weber

Stefan Xalter

Franz Sorg

Johannes Lippert

Dirk Schaffer

Thomas Bischoff

Ulrich Bingel

Hermann Bieg

Steffen Fritzsche

Tilman Schwertner

Henner Baitinger

Jochen Wieland

Paul Buettner

Heiko Methe

Sascha Licht

Bernd Wuesthoff

Hans-Jürgen Scherle

Fraser G Morrison

G Fraser Morrison

A mirror arrangement, in particular for a microlithographic projection exposure apparatus, includes at least one mirror element bearing a mirror surface provided for reflecting electromagnetic radiation, at least one carrier element including a head section, which is provided for receiving at least one mirror element, and also a seat section. The arrangement further includes a mount arrangement, for receiving the at least one carrier element. At least one insertion opening is in the mount arrangement. The seat section of the carrier element plunges into the insertion opening. In addition, the arrangement includes a channel device for guiding a heat transfer medium is formed in the mount arrangement in the region surrounding the seat section. A method for dissipating heat is provided.

Mirror arrangement for microlithographic projection exposure apparatus and related method

An optical component for a projection exposure apparatus includes a multiplicity of variably positionable beam-guiding elements which serve as pupil facets. The optical component can be arranged in the beam path of the projection optical unit.

Optical component

The disclosure relates to an optical assembly for a projection exposure apparatus for semiconductor lithography. The optical assembly includes at least one optical element and a mounting body for mechanically fixing the element in a supporting structure. The optical assembly also includes at least one cooling body for dissipating heat from the element. The mounting body and the cooling body are separate from one another. The optical element is connected to the cooling body via at least one heat-conducting element. The disclosure also relates to a projection exposure apparatus including an optical assembly according to the disclosure.

Optical element

There is provided an optical element unit comprising an optical element, a connector element, and an optical element holder. The optical element has a plane of main extension as well as an outer circumference and defines a radial direction. The connector element connects the optical element and the optical element holder, the connector element having a first connector part connected to the optical element at the outer circumference and a second connector part connected to the optical element holder. The first connector part and the second connector part are connected via at least one coupling part, the coupling part being compliant in the radial direction and substantially preventing rotation between the first connector part and the second connector part in a plane substantially parallel to the plane of main extension.

Optical element unit and method of supporting an optical element

There is provided an optical module for microlithography. The optical module includes an optical element and a retaining device for holding the optical element. The optical element has (a) a main extension plane, in which it defines a radial direction R and a circumferential direction U, and (b) a free optical diameter and an overrun in the region of its outer periphery. The retaining device contacts the optical element in the region of the overrun, and is formed and/or contacts the optical element in such a manner that the overrun ratio, calculated from the overrun related to a minimum overrun necessary for the production of the optical element, is at most 1.5.

Optical module with minimized overrun of the optical element

The disclosure relates to a connecting arrangement for an optical device, such as in microlithography. The connecting arrangement includes a first body, a second body and a connecting device. The first body contacts the second body in a laminar manner in a contact region. The connecting device is connected to the second body and contacts the first body via at least one contact unit. The connecting device is configured to generate a predefinable contact force in the contact region between the first body and the second body. The contact unit includes a plurality of separate contact elements. Each contact element is connected to the second body via a spring unit which can be elastically deformed to generate a contribution to the contact force.

Connecting arrangement for an optical device

An optical element module comprising a plurality of module components is provided. The module components comprise an optical element, an optical element holder and a contact element. The optical element has a first coefficient of thermal expansion. The optical element holder holds the optical element via the first contact element and has a second coefficient of thermal expansion, the second coefficient of thermal expansion being different from the first coefficient of thermal expansion. At least one of the module components is adapted to provide at least a reduction of forces introduced into the optical element upon a thermally induced position change in the relative position between the optical element and the optical element holder, the position change resulting from a temperature situation variation in a temperature situation of the plurality of module components.

Optical element module

There is provided an optical element comprising an optical element body, a reflecting area and an optical passageway. The optical element body defines an axis of rotational symmetry. The reflecting area is disposed on the optical element body and adapted to be optically used in an exposure process. The optical passageway is arranged within the optical element body and allows light to pass the optical element body, the optical passageway being arranged eccentrically with respect to the axis of rotational symmetry.

Reflecting optical element with eccentric optical passageway

An optical subassembly with an optical element, for example a mirror element (), has an optical surface () and bearing points () arranged on the circumference. The optical element () is connected to a mount () at the bearing points () via connecting elements (). Stress-decoupling cutouts, for example curved slots (), are provided between the optical surface () and the bearing points ().

Optical subassembly and projection objective in semiconductor lithography

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Aalen, Germany

Willi Heintel