Motorola Corporation

Freescale Semiconductor,inc.

Will Specks

Ricardo Erckert

Michel Burri

Steven Bruce McAslan

Matthew B Ruff

Markus Strecker

Francoise Vareilhias

Mervi Paulasto

Aldan J Pohlmeyer

Nils Bossemeyer

Markos Triantafyllou

Claude Escoffre

Embodiments of the present invention related generally to communication systems. One embodiment contemplates a method for operating a communication bus where the method includes detecting a start of frame symbol on the communication bus; determining a length of the start of frame symbol; detecting a start of a synchronization field on the communication bus; determining a length of an adjusted synchronization field; determining if the length of the adjusted synchronization field is less than the length of the start of frame symbol; and if the length of the adjusted synchronization field is less than the length of the start of frame symbol, concluding that the start of frame symbol is valid and concluding that the synchronization field is valid. Embodiments of the invention may be used, for example, with the Local Interconnect Network (LIN) protocol.

Method and apparatus for operating a communication bus

An electronic package assembly includes a number of semiconductor devices with first and second sides. A printed circuit substrate has a number of printed circuit patterns bonded to conductive pads of the first sides of the devices. A metal leadframe includes leads which provide external connections for the package assembly, and also includes a non-lead island portion bonded to conductive pads of the second sides of the devices. In this way the island portion of the leadframe forms an interconnection between the second sides of the devices.

Electronic package assembly

An electronic system ( ) for use in a car has an electronic control unit ( ) and, in the alternative, either a passive load ( ) or an active logic ( ) attached thereto. The control unit ( ) comprises a push-pull arrangement ( ) which can provide drive signals for the load ( ) as well as for the logic ( ), a multiplexer ( ) to alternatively forward a load drive signal of a bus signal to the arrangement ( ), and a register ( ) to store a mode signal. Further, the control unit ( ) automatically determines whether either the load ( ) or the logic ( ) is attached by analyzing electrical parameters.

Electronic driver circuit with multiplexer for alternatively driving a load or a bus line, and method

An electronic package ( ) has a semiconductor device ( ), a two-layer ( ) printed circuit substrate ( ), and a lead ( ) for providing external connections for the package assembly ( ). The first layer ( ) has an electrical conducting surface structure ( ); and the second layer ( ) has a recess ( ) to receive the device ( ). The device frontside ( ) is electrically coupled to the conducting surface structure ( ) of the first layer ( ) in a flip-chip arrangement. The backside ( ) of the device ( ) is coplanar to the surface ( ) of the second layer ( ). The lead ( ) at least partially overlays the surface ( ) of the second layer ( ).

Electronic device package, and method

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Munich, Germany

Will Specks