Besi Netherlands B.v.

Fico B.v.

Wilhelmus Gerardus Jozef Gal

Henricus Antonius Maria Fierkens

Michel Hendrikus Lambertus Teunissen

Albertus Franciscus Gerardus Van Driel

Martin Herman Weggen

Franciscus Bernardus Antonius De Vries

The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for transfer moulding encapsulating electronic components mounted on a carrier using such a mould.

Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such

The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.

Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators

The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method.

Method for moulding and surface processing electronic components and electronic component produced with this method

The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.

Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier

The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the component, and c) encapsulating the electronic component with encapsulating material, wherein the foil layer undergoes a treatment whereby the adhesion of the foil layer is increased such that it adheres to the carrier. The invention also relates to a foil material for applying during such a method.

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Kilder, Netherlands

Wilhelmus Gerardus Jozef Gal