Hewlett-packard Company

Other

Lambda Physik Ag

Ingenieurbuero Tamm Factory Innovations

Wilhelm Tamm

Si-Ty Lam

Siegfrid Dippon

Herbert Gross

Hans-Jurgen Kahlert

Albert Ott

Walter Olbrich

Robert Grub

Jurgen Schweizer

Volker Harr

Heinrich Endert

Michael Weitmann

Steffen Laur

Joachim Schulte In Den Baumen

An adapter arrangement for electrically testing printed circuit boards consists of two probe adapters with a uniform grid separation of the probes and two translator foils on whose sides facing the probe adapters there are contact areas with the pitch of the probe adapter. On the sides facing the printed circuit board, the arrangement of the contact areas and the contact points located thereon is the same as the grid on the printed circuit board under test. Between the translator foils a vacuum is generated with the help of rubber seals, a through hole, a valve and a suction hose. This vacuum creates a rigid package which permits good contact with the probes on both sides. The inserted support layers, which can be conventional printed circuit boards, prevent the translator foils from buckling. The various types of extremely complex printed circuit board can be electrically tested rapidly and cheaply using this arrangement. The arrangement can be employed on both double-sided and one-sided electrical test installations.

Adapter arrangement for electrically testing printed circuit boards

A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in particular by means of laser-ablation, wherein the recesses and/or through holes correspond to the desired structure of conductive tracks and/or plated through holes; introducing a base layer (6) on one or both sides of the substrate (1); and introducing a conductive material (7) onto the base layer (6) which is catalytic and/or activating relative to the conductive material (7). The base layer (6) is selectively removed from the substrate (1), except in the recesses and/or in the through holes, by means of laser-ablation prior to introduction of the conductive material (7). Processing of the surface of the conductive material, the base layer or of the substrate is no longer necessary.

Method for the production of printed circuit boards

An apparatus for laser machining by creating a plurality of discrete and separate beams which are sent to a deflecting device including a support and a plurality of individual elements that act independently and are individually controlled to machine different points on the workpiece simultaneously.

Apparatus for laser machining with a plurality of beams

A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.

Method of manufacturing printed circuit boards

Growing community of inventors

Aidlingen, Germany

Wilhelm Tamm