Infineon Technologies Ag

Osram Opto Semiconductors Gmbh

Wilhelm Karsten

Hans-Ludwig Althaus

Gerhard Kuhn

Wolfgang Gramann

Martin Haushalter

Andreas Wojcik

Frank Möllmer

Heinz Haas

Markus Wicke

Michael Sailer

Alfred Rast

Hubert Schmid

Sven Weber-Rabsilber

An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.

Reflecto trough for an optoelectronic semiconductor component

An optical device includes a surface-mountable optical component with a base member having a recess filled with a transparent filler and a VCSEL element arranged in the recess. A receptacle is attached to the surface-mountable optical component. The receptacle is for receiving an optical fiber to optically connect the VCSEL element to the optical fiber. Accordingly, an inexpensive way of coupling a VCSEL element with an optical fiber is provided. In particular, the surface-mountable component can be produced using a high volume production so that the overall costs of the optical device are reduced, even if the receptacle is produced in lower numbers due to varying requirements in the way that the VCSEL will be coupled to an optical fiber.

Optical device

Growing community of inventors

Wuppertal, Germany

Wilhelm Karsten