Epcos Ag

Siemens Matsushita Comp. Gmbh & Co Kg

Conti Temic Microelectronic Gmbh

Wilhelm Grimm

Harald Vetter

Reinhard Sperlich

Wilhelm Hübscher

Edmund Schirmer

Hermann Kilian

Gerhard Hiemer

Hermann Bäumel

George Dietrich

Dietrich George

The invention relates to a capacitor component having a first integrated capacitor (C) and an integrated Y capacitor, wherein the Y capacitor has a second capacitor (C) and a third capacitor (C), and the second and third capacitor (C, C) are connected in series with one another and in parallel with the first capacitor (C). The invention further relates to a method for producing such a capacitor component.

Capacitor component

A power electronics module includes a capacitor having a trough-shaped housing and at least one capacitor winding. An electronic unit includes a base on which the capacitor is mounted. A cooling plate in thermal contact with a cooling surface of the capacitor is formed by a bus bar. The cooling plate is on the base of the electronic unit.

Power capacitor

A power capacitor is described herein. The power capacitor includes a housing and at least one capacitor winding. The power capacitor also includes at least one mechanical spring element between the housing and the at least one capacitor winding.

An overload current protection arrangement is composed of a thin metallization that is applied onto a carrier foil. The metallization preferably is contacted by schoopage layers. The metallization can be constructed as a layered stack of metallized carrier foils.

Overload current protection

In an electrical component that contains materials that can physically and/or chemically change under the influence of heat (infrared) radiation required during processing of the component and which in particular, is suitable for employment on printed circuits, a surface layer that reflects the heat (infrared) radiation is arranged at the outside of the component.

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Roth, Germany

Wilhelm Grimm