Novellus Systems Incorporated

Wilbert G H Van Den Hoek

John Stephen Drewery

John R Kelly

The present invention pertains to apparatus and methods for electroplanarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by use of a flexible planar cathode and a spacing pad thereon. Methods of the invention are electropolishing methods. During electroplanarization, the flexible planar cathode conforms to the global contour of the work piece (e.g. a wafer) while the spacing pad conforms to local topography of the metal layer being planarized. In this way, dishing is reduced in the final planarized metal layer.

Growing community of inventors

Saratoga, CA, United States of America

Wilbert G H Van Den Hoek