Samsung Electronics Co., Ltd.

Whan Namkoong

Chang-Hwan Kim

Jun-Young Jang

Sang-Oh Park

A semiconductor device includes a plurality of cylindrical structures located at vertices and central points of a plurality of hexagons in a honeycomb pattern, and a unitary support having a plurality of openings. Each of the openings exposes a part each of four of the cylindrical structures. Each of the openings has the shape of a parallelogram or an oval substantially. A first distance between opposite cylindrical structures of a first pair of the four cylindrical structures exposed by each opening is shorter than a second distance between opposite cylindrical structures of a second pair of the four cylindrical structures exposed by the opening. The first distance is equal to a distance between the central point and each of the vertices of the hexagon.

Semiconductor devices including unitary supports

A method of measuring the thickness of a thin layer formed on a substrate comprises generating a measured signal spectrum by reflecting a light off of the thin layer and analyzing a resulting reflected light. The method further comprises generating a theoretical signal spectrum based on a putative thickness of the thin layer, and computing a skew signal spectrum as a difference between the measured signal spectrum and the theoretical spectrum. The method still comprises computing a reliability index by dividing a reference index by an area of the skew signal spectrum and using the reliability index to update the theoretical signal spectrum in a regression fitting process.

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Seoul, South Korea

Whan Namkoong