Minnesota Mining and Manufacturing Company

3m Innovative Properties Company

Exclusive Design Company

Wesley J Bruxvoort

Richard J Webb

Jerry W Williams

Scott R Culler

Fred Boyle McCormick

Clyde D Calhoun

Steven J Keipert

John J Gagliardi

Daniel B Pendergrass, Jr

John D Haas

Todd J Christianson

Bradford B Wright

Denise R Rutherford

Douglas P Goetz

Robert J Streifel

Michael J Muilenburg

Jerry J Fizel

Chong-Yong J Kim

Cristina U Thomas

James D Buhler

William J Hollywood

Thomas P Klun

Carl R Kessel

George D Foss

David A Kaisaki

Heather K Kranz

Philip E Kendall

Kwok-Lun Ho

Maurice J Fleming

Robert P Messner

Julia P Williams

Robert N Howard

Soon C Park

The present invention is directed to a method of making a three-dimensional fixed abrasive article, and a three dimensional fixed abrasive made thereby. The method comprises providing an abrasive composition comprising a plurality of abrasive particles and a binder precursor. The binder precursor comprises a polymerizable material consisting essentially of an ethylenically unsaturated material having one or more terminal functional groups of the same type of reactive functionality, a photoinitiator, and a thermal initiator. The abrasive composition is then applied onto a backing. The method then comprises at least partially curing the binder precursor by activating the photoinitiator, and further curing the binder precursor by activating the thermal initiator to provide a three-dimensional fixed abrasive.

Dual cured abrasive articles

A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abrasive article having a window system for polishing wafers, and methods

An abrasive article includes a fixed abrasive element, a resilient element, a rigid element disposed between the resilient element and the fixed abrasive element, and a plurality of microstructures disposed between the rigid element and the fixed abrasive element.

Abrasive article suitable for modifying a semiconductor wafer

An energy sensitive composition comprising a monomeric organometallic complex essentially free of nucleophilic groups and which, upon exposure to energy, bonds to basic reactive sites on a substrate via the metal center, leaving the polymerizable group of the complex unreacted and unrestricted; an energy sensitive composition at least one energy sensitive organometallic group is incorporated in or appended to the backbone of a polymer, such that the resulting coordinatively unsaturated organometallic group or groups bond to basic reactive sites on a substrate, thus forming permanent bonds, and further, the adherent compositions are useful in applications such as adhesion of polymers to substrates, protective coatings, printing plates, durable release coatings, primers, binders, and paints.

Organometallic monomers and polymers with improved adhesion

Abrasive article comprising organometallic coupling agent

An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

Abrasive construction for semiconductor wafer modification

A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:

Method of modifying an exposed surface of a semiconductor wafer

An abrasive article having a sheet-like structure having at least one major surface having deployed thereon a plurality of individual abrasive composites, each abrasive composite comprising a plasticizer and a plurality of abrasive particles dispersed in a binder, wherein said binder is formed by polymerizing a binder precursor and said plasticizer being combined with said binder precursor prior to said polymerizing in an amount of 30 to 70 parts plasticizer per 100 parts by weight of the combined binder precursor and plasticizer. There is also a method of using such as abrasive article to reduce the surface finish of a workpiece and a process of making the abrasive article.

Abrasive article, a process for its manufacture, and a method of using

An abrasive article comprising a coated abrasive bonded to a substrate by means of a metallic adhesive and a method for producing the abrasive article by heating.

Abrasive article and processes for producing it

The present invention provides an abrasive article that has abrasive composite members secured firmly in recesses in a backing sheet in a precise pattern whereby there is desired lateral spacing between each abrasive composite member. The present invention also provides a method for preparing the abrasive article comprising the steps of providing an embossed backing sheet having a plurality of recesses in the front surface of the backing sheet. The recesses are filled with an abrasive slurry that includes a plurality of abrasive grains dispersed in a binder precursor. An expanding agent is also provided in the recesses, either separate from the slurry or dispersed in the slurry. The expanding agent, when activated, expands the abrasive slurry outward and above the front surface of the embossed backing sheet. After the binder precursor of the abrasive slurry is hardened, individual abrasive composite members extend above the front surface of the embossed backing sheet. An alternative embodiment provides recesses that extend completely through the embossed backing sheet, so that abrasive composite members protrude from the front surface and from the back surface of the embossed backing sheet.

Abrasive article having abrasive composite members positioned in recesses

Abrasive sheeting can produce fine finishes at surprisingly high cutting rates when its abrasive granules are individually positioned in a predetermined pattern, with an uncoated portion of virtually every granule protruding from the surface of the binder layer. Each of the abrasive granules preferably is a spherical composite of a large number of abrasive grains in a binder. For example, abrasive grains having a mean dimension of about 4 .mu.m can be bonded together to form spherical abrasive granules of virtually identical diameters, preferably within a range of from 25 to 100 .mu.m.

Abrasive sheeting having individually positioned abrasive granules

Growing community of inventors

Woodbury, MN, United States of America

Wesley J Bruxvoort