Rodel Holdings, Inc.

Wesley D Costas

James Shen

Craig D Lack

Tirthankar Ghosh

Terence M Thomas

Jinru Bian

Daniel Alain Saucy

Ross E Barker, Ii

Glenn C Mandigo

Karel-Anne Valentine

Polishing composition having a surfactant

Compositions for insulator and metal CMP and methods relating thereto

CMP polishing composition for semiconductor devices containing organic polymer particles

A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface. Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.

This invention describes methods of polishing with pads useful in the manufacture of semiconductor devices or the like. These pads have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance. These pads provide exceptional performance when used for polishing in conjunction with a slurry in which the abrasive particles are stabilized by use of an amino alcohol. They are also useful when used with slurries comprising an organic polymer.

Method of polishing

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Bear, DE, United States of America

Wesley D Costas