Intel Corporation

Dell Products Inc.

Wesley Brook Morgan

Srikant Nekkanty

Aleksander Magi

Nitin A Deshpande

Duck Young Kong

Xiaoqian Li

Michael A Hyde

Divya Pratap

Ralph W Jensen

Vineeth Abraham

Michael T Crocker

Jun Lu

Paul J Diglio

Gregorio R Murtagian

Darren Burke Pav

Todd R Coons

Eric J Moret

Guoliang Ying

Liguang Du

Guangying Zhang

Fangbo Zhu

Wei Liao

Juan Antonio Orozco Ramirez

Song Kok Hang

James T Goulding

The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Method and device for fast, passive alignment in photonics assembly

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

Enabling passive alignment for lens attach

Techniques for liquid cooling systems are disclosed. In one embodiment, jet holes in a water block create jets of liquid coolant to be applied to a surface to be cooled, such as a surface of an integrated circuit component. The jets of liquid coolant may disrupt surface boundary layers through turbulence and/or microcavitation, increasing the cooling effect of the liquid coolant. In the illustrative embodiment, negative pressure is applied to a coolant loop of the liquid coolant, which provides several advantages such as being resistant to leaks. In another embodiments, jet holes in a water block create jets of liquid coolant that are directed toward other jets of liquid coolant, which also increases the cooling effect of the liquid coolant.

Technologies for liquid cooling systems

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Package expanded beam connector for on-package optics

Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

Package protector with integrated guide pin

Peripheral component interconnect card panel set

Peripheral component interconnect card panel

An expansion planar system includes an expansion planar mounted to an expansion planar chassis and including expansion component(s) coupled to a system connector. A coupling subsystem mounted to the expansion planar chassis couples to a system chassis that includes a main planar and an expansion connector. While coupled to the system chassis, the coupling subsystem may provide the expansion planar chassis in a first orientation in which the system connector engages the expansion connector and the expansion planar chassis impedes access to component(s) on the main planar. While coupled to the system chassis, the coupling subsystem may also provide for rotation of the expansion planar chassis relative to the main planar to disengage the system connector from the expansion connector and provide the expansion planar chassis in a second orientation in which access to the component(s) on the main planar is no longer impeded by the expansion planar chassis.

Expansion planar coupling system

Embodiments of the present disclosure are directed toward techniques and configurations for a printed circuit board (PCB) assembly mountable to a computer chassis. In one instance, the PCB assembly may comprise a PCB having two through holes and a PCB mounting device that may include a U-shaped component having a non-linear portion and two rods extended from the non-linear portion and a housing having a base with protrusions extending from ends of the base. The rods may be extended through the protrusions such that the base and the non-linear portion of the U-shaped component form an opening to engage a mounting element of the chassis. The extended portions of the rods may be inserted into and soldered to the through holes of the PCB, to electrically couple the PCB to the PCB mounting device and the chassis to ground the PCB. Other embodiments may be described and/or claimed.

Printed circuit board mounting and grounding device

Growing community of inventors

Olympia, WA, United States of America

Wesley Brook Morgan