Interlock Ag

Identive Group, Inc.

Interflex Satensysteme Gmbh

Werner Vogt

Christian Looser

Andreas Braun

Andreas Looser

Anton Schuhwerk

Dual interface modules, and methods for manufacturing the same, are described. A substrate layer is provided with at least one dual interface section. At least two first through-holes are formed in the substrate in each dual interface section. A first connection element is arranged in each first through-hole. Each first connection element is connected to a contact pad that is arranged on a first side of the substrate. Each first connection element is connected to a connection pad that is arranged on a second side of the substrate. At least one electronic element is arranged on the second side of the substrate in each dual interface section. Two second through-holes are formed in the substrate in each dual interface section. Two soldering pads with a first side and a second side are arranged on the second side of the substrate layer.

Dual interface module and dual interface card having a dual interface module manufactured using laser welding

Described herein are methods and apparatuses for manufacturing a pre-cut plastic card structure via laser cutting, having a plastic card, plastic card prelaminate and sticker separable from the plastic card structure. The plastic card prelaminate includes a first plastic sheet, a first adhesive layer arranged below the first plastic sheet, a release layer arranged below the first adhesive layer, a laser barrier layer arranged below the release layer, and a second plastic sheet arranged below of the laser barrier layer.

Plastic card prelaminate and plastic card structure

Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.

Card lamination

A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.

Dual interface module and dual interface card having a dual interface module

The invention relates to a card having a card base body () and a plastic layer () joined thereto. According to the invention, the delimiting edge(s) of the plastic layer () is/are set back from the card edge(s) and comprise(s) projections that terminate with the edge(s) of the card base body () in a flush manner.

Card

A transponder label including a transponder film, a chip mounted on the transponder film and an adhesive layer. The adhesive layer has a thickness that is equal to the thickness of the chip. The adhesive layer also has a recess in an area of the chip, which recess has a contour that matches the shape of the chip.

Transponder label

A method for producing information carriers in the form of cards, in particular credit cards, passes, identification cards, admittance cards etc., the laminating process including placing at least one card template which is to be sized, preferably a laminate consisting of a plurality of sized card layers, into a hollow mold and subjecting it to a simultaneous action of pressure and heat for a predetermined time. The material placed into the hollow mold is heated over at least one large area, as known per se by the use of heating plates, and in the peripheral, narrow, outer boundary region of the inserted material quantities of heat flowing off per se there are retained, blocked in, reflected and concentrated back onto the laminate template.

Method and device for producing card-like information carriers

A method for manufacturing a tag encompassing an antenna or coil that is capable of at least one of wirelessly transmitting information to remote receivers and receiving information from remote transmitters. The method includes die-cutting a coil or antenna shape from an electrically conductive flat double foil having an upper electrically conductive flat foil layer of a soft, inelastic metal and a lower synthetic film substrate layer, the die-cutting including cutting with a die-cutting tool having a single die-cutting blade which matches the desired antenna or coil shape, the blade completely perforating the upper electrically conductive flat foil and at least partially separating the lower synthetic film substrate so that a gap the distance created in the flat foil by die-cutting remains after the die-cutting tool is removed. Subsequently the cut shape is bonded with additional layers including an electronic chip module.

Method for producing a tag or a chip card having a coil antenna

For producing identity cards, access cards, identification cards, or the like, containing electronic and/or electric components, including such with outwardly directed contacts, it is proposed that at least one central layer of the card, containing also the electronic and/or electric components or consisting thereof, be initially retained in floating condition by adhesive quantities applied as floating mass at least on one inner face, and be then progressively compressed to a thickness that is predetermined by stops, without any application of heat, and be finally cured so that the electric and/or electronic components are supported in the finished card, embedded in the intermediate adhesive layer so formed.

Method for producing identity cards, and identity card produced

For laminating layers consisting at least in part of thermoplastic films, in particular for producing identification cards, or the like, carrying information and/or data, a method is proposed where the blank, after having been introduced between pressing dies, is initially subjected to the pressure and heat required for complete lamination of the blank. Heat dissipation is prevented during heating by the fact that cooling components are kept at a predetermined distance from the heating surfaces. During a subsequent transition from heating to cooling, the heating effect is terminated and cooling bodies are brought into contact with the pressing and heating components, for reducing the temperature of the completely laminated product.

Method and device for laminating layers of identification cards, or the

A forgery-proof optoelectric card system is disclosed which includes a reader and code card comprising invisible light and dark codings forming at least one reading track. At least one reading head is provided which may comprise a photodiode as a ligh source and a phototransistor as a light receiver. The light codings having a first pass band to infrared light. Superimposed over selected ones of said light codings are filters having an attenuation band that is narrower than and lies within the pass band of the light codings. Additionally, a secondary light receiver responsive only to light lying within the attenuation band of the filter is provided.

Growing community of inventors

Remetschwil, Switzerland

Werner Vogt