Infineon Technologies Ag

Osram Opto Semiconductors Gmbh

Werner Sp&auml;th

Georg Bogner

Hans-Ludwig Althaus

Axel Schubert

Hans Hurt

Klaus Panzer

Gustav M&uuml;ller

Stefan Gr&ouml;tsch

Ulrich Steegm&uuml;ller

A polarization detector is described which contains a beam splitter, which disperses an incident light beam into partial beam paths. The partial beams pass though &lgr;/4 wafers and a cholesterol layer and impinge upon detectors. The polarization direction of the incident light beam can be measured by the polarization detector with the aid of the signal level of the detectors.

Polarization detector and method for fabricating the polarization detector

A transmission and reception device, in which the transmission device and the reception device and the input/output end of a glass fiber are disposed optically in series with respect to one another. A laser diode is disposed on a central part of a photosensitive surface and the input/output end of the glass fiber is in turn adjusted in front of its end face. As a result of a cylindrical symmetry of the photosensitive surface and of the laser diode with respect to a fiber axis, a maxima of the coupling curves coincide with the fiber axis, so that a lateral fiber offset leads to only a moderate change in coupling efficiency.

Two-way optical transmission and reception device

An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device has a radiation source in the form of a laser in the infrared wavelength range. The support is formed by a heat body, which is assigned to the chip-substrate connection and is heated with thermal radiation by the radiation source. A surface of the heat body is coated with a material, in particular a material containing chromium, exhibiting high absorption with respect to the light radiation emitted by the radiation source.

Apparatus and method for producing a chip-substrate connection

Growing community of inventors

Holzkirchen, Germany

Werner Späth

Growing community of inventors

Holzkirchen, Germany

Werner Sp&auml;th

Werner Späth