Rittal Res Electronic Systems Gmbh & Co. Kg

Schroff Gesellschaft MIT Beschrankter Haftung

Werner Sonnabend

Wolfram Breitling

Kurt Schaffer

Mouhamadou Ousmane

Wilfried Braun

A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be cooled, on the respective printed circuit board or the plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The printed circuit board or the plug-in module has an area for fitting electronic components and a coupling area for coupling the feed line with the component feed line and for coupling the return-flow line with the component return-flow line.

Cooling arrangement

A multi-layer circuit board which includes at least two boards carrying conductors and a shielding foil interposed between the two boards. The circuit board is provided with a through hole including a metallic lining in electrical connection with the shielding foil. The lining includes an insulating layer on which a conductive metal layer is disposed. The metal layer, electrically separated from the lining by the insulating layer, is in electrical connection at respective ends thereof with the conductors. By virtue of this arrangement a coaxial design of a through hole results thereby permitting a total decoupling with respect to adjacent or neighboring through hole connections.

Growing community of inventors

Straubenhardt, Germany

Werner Sonnabend