Steag Hamatech Ag

Infineon Technologies Ag

Steag Hamatech Ape Gmbh & Co. Kg

Hamatech Ape Gmbh & Co. Kg

Werner Saule

Peter Dress

Uwe Dietze

Jakob Szekeresch

Marlene Strobl

Robert Weihing

Christian Bürgel

Christian Krauss

Martin Tschinkl

Lothar Berger

Anatol Schwersenz

Andreas Nöring

This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

Method and device for the thermal treatment of substrates

The aim of the invention is to achieve a rapid, homogeneous application of a liquid with as little force as possible to a substrate. To achieve this, the invention provides a nozzle assembly () for applying a liquid to a substrate, said assembly having a nozzle body () comprising a plurality of nozzles () that are substantially arranged in a line and a guide plate () that extends essentially in a vertical direction with a straight lower edge. According to the invention, the nozzles () above the lower edge are directed towards the guide plate () in such a way that a film of liquid forms on the guide plate () and flows over the lower edge ().

Nozzle assembly for applying a liquid to a substrate

To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.

Method for thermally treating substrates

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Bretten, Germany

Werner Saule