Epcos Ag

Siemens Aktiengesellschaft

Snaptrack Incorporated

Qualcomm Incorporated

Werner Ruile

Markus Hauser

Ulrike Roesler

Ulrike Rösler

Thomas Ostertag

Christoph Eggs

Anton Leidl

Leonhard Michael Reindl

Gerd Scholl

Markus Mayer

Ingo Bleyl

Ulrich Knauer

Michael Jakob

Thomas Bauer

Jurgen Machui

Veit Meister

Edgar Schmidhammer

Christian Korden

Thomas Ebner

Philipp Michael Jäger

Günter Kovacs

Gerd Riha

Stefan Berek

Clemens Ruppel

Hans Krueger

Valentin Magori

Wolfgang Sauer

Thomas Baier

Tomasz Jewula

Giuliano Visintini

Ulrich Wolff

Charles Binninger

Helmut Zottl

Christian Math

Karl-Christian Wagner

Hans-Peter Kirschner

Evelyn Riha

Rudolf Nuessl

Waldemar Gawlik

Jaroslaw Konopka

Wolfgang Pahl

Reinhard Maier

Alois Stelzl

Jürgen Michel

Christian Bauer

Wolf-Eckhart Bulst

Thomas Metzger

Oliver Sczesny

Peter Zibis

Gudrun Henn

Wolfgang Schelter

Matthias Knapp

Ken-ya Hashimoto

Philipp Michael Jaeger

Roland Dill

Jiman Yoon

Guenter Scheinbacher

Tilo Gärtner

Ulrike R&ouml;sler

Holger Emrich

Martin Störkle

Thomas Finteis

Juurgen Machui

Stefan Kurp

Christoph Hartel

Brian Lewis

Siegfried Menzel

Mario Spindler

Urlike Rösler

Lijun Peng

Heide Kuhrau

G&uuml;nter Kovacs

The present invention relates to a filter circuit () comprising a first and a second bulk acoustic wave resonator (), the first resonator () having a first piezoelectric layer () structured such that the first resonator () has a lower resonant frequency than the second resonator (), wherein the first piezoelectric layer () is structured by recesses () passing through the first piezoelectric layer (), the first resonator () and the second resonator () as series resonators () connected in series with a signal path of the filter circuit () or wherein the first resonator () and the second resonator () as parallel resonators () are connected to the signal path of the filter circuit () in such a way that in each case one electrode of the resonators is connected to the signal path.

Filter circuit

For a component operating with acoustic waves, it is proposed to provide a compensation layer on the component for compensating for a negative temperature coefficient of the frequency, which includes a material based on a chemical compound made up of at least two elements, which has a negative thermal expansion coefficient.

Micro-acoustic component having improved temperature compensation

The present invention relates to a filter chip (), comprising an interconnection of at least one first and one second resonator () operating with bulk acoustic waves, wherein the first resonator () operating with bulk acoustic waves comprises a first piezoelectric layer () that is structured in such a way that the first resonator () has a lower resonant frequency than the second resonator ().

Filter chip and method for producing a filter chip

An improved electroacoustic transducer with an improved mode profile is provided. The transducer comprises a velocity profile with a periodic structure and an edge structure flanking the periodic structure. The velocity profile also allows to suppress the SH wave mode.

Electroacoustic transducer with improved suppression of unwanted modes

An electroacoustic component includes a substrate configured to carry acoustic waves. The electroacoustic component can be a guided bulk acoustic wave (GBAW) device, for example. A structured electric conductive layer is arranged on the substrate and an electrically dielectric layer (for example, aluminum oxide) is also arranged over the substrate.

Electricoacoustic component with structured conductor and dielectric layer

A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.

Metallization having high power compatibility and high electrical conductivity

An electroacoustic transducer has reduced loss due to acoustic waves emitted in the transverse direction. For this purpose, a transducer comprises a central excitation area, inner edge areas flanking the central excitation area, outer edge areas flanking the inner edge areas, and areas of the busbar flanking the outer edge areas. The longitudinal speed of the areas can be set so that the excitation profile of a piston mode is obtained.

Electroacoustic transducer having reduced losses due to transverse emission and improved performance due to suppression of transverse modes

An electroacoustic filter has improved low-pass characteristics. The filter includes a first electroacoustic converter, an electroacoustic element and a grid structure between the converter and the element. The grid structure is acoustically active in one frequency range that lies above the acoustically active frequency range of the first electroacoustic converter.

Electroacoustic filter comprising low-pass characteristics

An electroacoustic transducer has a piezoelectric layer, which is structured in such a way that, in the case of an alternating electric field applied in one spatial direction, an oscillation mode with oscillations in three spatial directions is excited.

Electroacoustic transducer

The invention concerns a component (B) operating with acoustic waves, in which the reflection and excitation are largely decoupled. For this purpose, a component comprises a dielectric (DL) which is arranged between an electrode finger (EF) and a piezoelectric substrate (PSU) and at least partially overlaps the electrode finger.

Component operating with acoustic waves and method for producing same

The present invention relates to an electroacoustic transducer which is arranged in an acoustic track (AS) and on a piezoelectric substrate () and which has two electrodes () which are arranged on the substrate () and which have interengaging electrode fingers () for exciting acoustic waves. The electrode fingers () of an electrode () are interconnected. The transducer also has means for increasing the mass occupation in a central excitation region (ZAB) which runs parallel to the acoustic track (AS), and the mass occupation in the central excitation region (ZAB) is higher than in an edge region (RB) which adjoins the central excitation region (ZAB) from both sides.

Electroacoustic transducer with reduced losses due to transverse emission and improved performance due to suppression of transverse modes

A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.

The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method.

Method of producing a microacoustic component

A method for producing an electric component including a dielectric layer on a substrate, includes the method steps of applying a metallic layer to the substrate and oxidizing the metallic layer to form a dielectric layer, wherein at least one partial region of the metallic layer is fully oxidized through the entire thickness of the layer.

Method for producing an electric component

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Munich, Germany

Werner Ruile