Siemens Aktiengesellschaft

Leuze Electronic Gmbh +co.

Werner Reindl

Virinder Grewal

Hans-Hermann Spratte

Process for marking semiconductor surfaces

A mirror structure which is provided on a polished metallic surface characterized by an adhesive layer disposed directly on the surface, an amorphous intermediate layer disposed on the adhesive layer, a reflective layer disposed on the amorphous intermediate layer and a protective layer covering the reflective layer. The mirror structure is particularly useful for a highly adhesive and corrosion-proof laser mirror which has good reflection properties and is used in a laser flatbed scanner.

Mirror structure

A method for manufacturing solderable, temperable thin film tracks which do not contain precious metal on an electrically non-conductive substrate serving as a carrier employs the steps of applying an adhesive or resistance layer to the substrate, which serves as an intermediate layer, applying a conductive layer over the intermediate layer, and applying a protective anti-corrosion layer over the conductive layer. The protective layer may consist of aluminum or an aluminum alloy, or may be comprised of a combination of a layer of aluminum and a layer of chrome. An aluminum layer may also be applied between the intermediate layer and the conductive layer.

Growing community of inventors

Unterhaching, Germany

Werner Reindl