International Business Machines Corporation

Other

Werner O Haug

Rainer Clemen

Joerg Gschwendtner

Erich Klink

Helmut Schettler

Thomas Ludwig

Otto M Wagner

Robert Schnadt

Rainer Stahl

Karl E Kroll

Utz G Baitinger

Knut K Najmann

Karl E Kroell

Otto G Folberth

Walter Fischer

For printing special symbols, particularly stamps onto letters and packages, increasingly so-called thermal transfer printing methods are used. When inserting the thin transfer ribbon (,) over the printing head (,), the ribbon (,) is frequently partially damaged or even torn. The proposed printing mechanism makes it possible to reduce the time required for exchanging the ribbon (,), on the one hand, and to substantially reduce the damage to the ribbon, on the other hand. The object is met by a guide rod (,) provided on a stirrup (,).

Thermal printing mechanism

Integrated circuit package comprising a power supply distribution wiring and a chip interconnection signal wiring both formed on the top surface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented. Spaced wells (4) of a first conductivity type are provided in the surface of said carrier of a second conductivity type. The power supply distribution wiring comprises first and second conductive lines (5,6) within a first wiring level (WL1). Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship. Said first and second conductive lines are connected to first and second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor. At least one active integrated circuit chip (1) is mounted and electrically connected to the passive semiconductor interconnection carrier (2).

Integrated circuit package

Integrated circuit package comprising a power supply distribution wiring and a chip interconnection signal wiring both formed on the top surface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented. Spaced wells (4) of a first conductivity type are provided in the surface of said carrier of a second conductivity type. The power supply distribution wiring comprises first and second conductive lines (5,6) within a first wiring level (WL1). Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship. Said first and second conductive lines are connected to first second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor. At least one active integrated circuit chip (1) is mounted and electrically connected to the passive semiconductor interconnection carrier (2).

An input circuit for a field effect transistor (FET) storage is described which consists of a bootstrap inverter which by a dynamically operating charge-up circuit is supplemented for charging up the bootstrap node to the full operating voltage, and which can be directly controlled with TTL levels without a level converter consisting of bipolar transistors being inserted. For that purpose, the input electrode of the bootstrap capacitor of the dynamically operating charge-up circuit is connected to the output of an inverter following the input circuit. Furthermore a discharge branch is provided for the node of the dynamically operating charge-up circuit. With its other end, together with the gate of the charge-up field effect transistor of the dynamic charge-up circuit, the discharge branch is connected to the output of another inverter following the first one. It is thus assured that when owing to the bootstrap effect the potential of the bootstrap node rises over the value VH of the operating voltage, this node cannot be discharged via the FET's in the charge-up circuit to the positive pole of the operating voltage source. This would counteract the rise of the potential of the bootstrap node so that the potential and the output of the input circuit would rise only slowly, and would not reach the full value VH of the operating voltage.

Bootstrapped level shift interface circuit with fast rise and fall times

This invention relates to a field effect transistor level converter for converting bipolar transistor logic levels to field effect transistor logic levels. First and second field effect transistors have their source and gate electrodes connected in common. The bipolar input signal is received at the common source connection while the gate electrodes receive a fixed reference potential that is equal to the threshold voltage VT plus the lowest possible high binary level of the bipolar input logic. The drain electrode of the first field effect transistor is connected to the output terminal of the level converter and the source electrode of a source follower transistor. The drain electrode of the second transistor is connected to a load device and to the gate of the source follower transistor which has its drain electrode connected to VH. This arrangement produces at the first output terminal a potential swing of approximately 0 to 7 volts in response to an input signal in the range of 0.8 to 2.0 volts.

FET Circuit for converting TTL to FET logic levels

Disclosed is a field effect transistor (FET) circuit for accepting a bipolar transistor logic level input signal and providing FET logic level output signals (both in-phase and out-of-phase components). The FET circuit includes a gated latch with means for pre-charging first and second nodes to an FET logic up level. One of the two nodes is brought to a slightly higher or lower level (depending on the binary value of the input), thereby producing a latent imbalance in the latch. A gating signal causes the latch to switch into the state pre-set by the latent imbalance.

TTL-Compatible address latch with field effect transistors

A recharging circuit is provided to maintain a high potential for a longer time interval at the output node of a FET driver circuit. The recharging circuit consists of a first FET which is made periodically conductive via a capacitor and periodically recharges a capacitance at the output node. This capacitance is first charged by a strong pulse of the driver circuit. A second FET is provided to prevent a current flow through the first FET and thus the generation of a power dissipating current when the output potential of the driver circuit is low. The gate of the second FET is connected to a supply voltage. Thus, the second FET is conductive when a low potential exists at the output node, transferring that potential to the gate of the first FET which, in turn, does not become conductive since its gate to source voltage is less than its threshold voltage.

Circuit for recharging the output nodes of field effect transistor

To the known sense latch already existing in a bit line pair in an FET memory, and to the two bit switches in each bit line another latch is arranged in series which furthermore is coupled to the common data input and output via a write driver on the one side and a read driver on the other. Both latches are of an identical structure and controlled by the same pulses in the read as well as in the write phase. The data path via the write driver and the read driver up to, or from, the additional latch is respectively designed as unidirectional double rail line, and selectively connectable via the bit switches with the bidirectional double rail line to the respective bit line pair.

Dynamic semiconductor memory read/write access circuit

Utilization of a chip internal clock driver, for capacitive loads such as MOS circuits, which provides in response to an external clock phase adjustable and delayed secondary clock pulses. The delay circuit is an inverter circuit which uses a precharged coupling capacitor whose potential is dynamically increased (boosted) by capacitive coupling the input pulse to approximately twice the supply voltage and which capacitor is subsequently discharged by a constant current thus defining a delay time in a more extended and more precise range.

Delay circuit with field effect transistors

Narrow channel field effect transistor

A semiconductor storage circuit for use in monolithic memories. The circuit is comprised of a storage cell coupled to input-output bit lines through active devices having symmetrical conduction properties. The storage cell can be comprised of a pair of cross coupled bipolar transistors having resistors as collector load devices. Schottky field effect transistors (MESFET's) are active devices having symmetrical conduction properties. The entire circuit of the invention is readily created in integrated form in semiconductor wafers using existing processes.

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Boeblingen, Germany

Werner O Haug