Cemecon Ag

Werner Kölker

Lars Hultman

Stephan Bolz

Oliver Lemmer

Walter May

Grzegorz Greczynski

Jürgen Balzereit

Joseph Greene

Ivan Petrov

The invention relates to a coating method and to a coating device for coating a body. A magnetron cathode having a target is arranged in the vacuum chamber. Electrical power is supplied to the magnetron cathode such that a plasma is generated and the target is sputtered in order to deposit a coating on the body. The electrical power is periodically supplied within a period duration T according to the HIPIMS method as cathode pulses, wherein each cathode pulse comprises at least two cathode sub-pulses and an intervening cathode sub-pulse break. In order to be able to deposit coatings having favorable properties in a particularly favorable manner by using the chopped HIPIMS method, a bias voltage is applied to the substrate to be coated with bias voltage pulses, wherein each bias voltage pulse comprises at least two bias sub-pulses and an intervening bias sub-pulse break.

Coating apparatus and coating method having divided pulses

The invention relates to a method for coating a substrate, a coating system for carrying out the method, and a coated body. In a first method step, the substrateis pretreated in a ion etching process. In a second method step, a first coating layerwith a thickness of 0.1 μm to 6 μm is deposited on the substrateby means of a PVD process. In order to achieve a particularly high-quality and durable coating, the surface of the first coating layeris treated by means of an ion etching process in a third method step, and an additional coating layerwith a thickness of 0.1 μm to 6 μm is deposited on the first coating layerby means of a PVD process in a fourth method step. The coated body comprises at least two coating layerswith a thickness of 0.1 μm to 6 μm on a substrate, wherein an interface region formed by ion etching is arranged between the coating layers

Multi-layer coating

The invention relates to a sputtering target, a coating system, and a coating method for same. The sputtering target comprises a base plate with a target plate which is secured thereon and which is made of a first sputtering material with a surface and a plurality of recesses formed therein. A plurality of inserts are arranged in the recesses. At least some of the inserts are made of a second sputtering material, wherein the second sputtering material has a higher sputter yield than the first sputtering material. The aim of the invention is to achieve especially uniform coatings. This is achieved in that the inserts made of the second sputtering material are shaped such that the extent D1, D2 of the inserts, measured in a measuring direction parallel to the surface, increases from the surface to the base plate in a depth direction T.

Sputtering target

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Herzogenrath, Germany

Werner Kölker