Infineon Technologies Ag

Infineon Technologies LLC

Werner Kröninger

Manfred Schneegans

Michael Melzl

Josef Schwaiger

Thilo Stache

Walther Grommes

Stephen Bradl

Reinhard Fischbach

Manfred Frank

Heinz Opolka

Günter Lang

Franz Hecht

Melanie Lutzke

Renate Köpnick

Richard Hummel

A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Method for machining a workpiece on a workpiece support

A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer

Explained, inter alia, is a method in which a workpiece () to be processed is fastened to a work carrier () by means of a solid (). The work carrier () is made of a porous material, e.g. of porous ceramic. This processing method permits simple manipulation of the wafer during the processing. In addition, the workpiece () can be easily separated from the work carrier () using a solvent.

Work carrier and method of processing a workpiece

A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

Scratch-resistant coating for a semiconductor component

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Albersdorf, Germany

Werner Kröninger