Henkel Kommanditgesellschaft Auf Aktien

Henkel & Cie G.m.b.h.

Henkel Kommanditgesellschaft Auf Aktien (henkel Kgaa)

E.i. Dupont De Nemours and Company

Henkel Corporation

Werner Gruber

Joachim Galinke

Jurgen Keil

Juergen Wichelhaus

Roberto Leoni

Angela Rossini

Bernd Wegemund

Norbert Wiemers

Johannes Andres

Peter Kuhm

Italo Albini

Wolf-Dieter Beiersdorf

Hans-Athanas Bruhn

Yuri Gololobov

Wolfgang Ritter

Serge Rebouillat

Guenter Henke

Rainer Wefringhaus

Christian Nicolaisen

Juergen Foell

Christian Block

Hans-Josef Hoffmann

Hans Scheer

Hanns R Misiak

Dagmar Behn

Julius Herold

Norbert Hubner

Brigitte Calaminus

Burkhard Muller

Birgit Gies

Franz-Josef Schueller

Manfred Dohr

Process for the collective pretreatment of steel, galvanized steel, magnesium and aluminum before bonding to rubber

Cyanoacrylate adhesives which have increased heat resistance, yet also exhibit good storage stability and acceptable cure times, are obtained by using 2-cyanopentadienoic acid esters in combination with alkylene bis-(2-cyanopentadienoates).

Cyanoacrylate adhesive

Process for the production of biscyanoacrylates

P-dinitrosobenzene

The processability of polymer fibers, and more specifically of aramid fibers, was intended to be improved. This object was attained by the use of resin solutions or dispersions of resins in an organic solvent containing

Resin solution for the surface treatment of polymers

Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cycloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Methods of making and using thermoplastic block copolymers

Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cyloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Method of making and using thermoplastic block copolymers

Thermoplastic polyamide mixtures of polyamides based on dimerized fatty acids in which at least one polyamide contains as an incorporated unit (a) a C.sub.2 -C.sub.10 aliphatic diamine capable of diamide formation, which is N-substituted with C.sub.10 -C.sub.25 -alkyl, and (b) a C.sub.2 -C.sub.40 -diamine capable of diamide formation comprising a diprimary amine, a heterocyclic amine, or a diomine containing one or two secondary amino groups and which is N-C.sub.1 -C.sub.8 -alkyl-substituted on at least one side.

Adhesive composition comprising thermoplastic polyamide from dimer acid

Thermoplastic polyamide resins with improved low-temperature flexibility and improved bonding properties consisting essentially of polycondensates of the following components:

Polyamide of dimerized fatty acids and polyether urea diamines and their

Adhesive composition comprising polyamide from dimer acid and N-alkyl

A hotmelt adhesive comprising a compatible mixture of at least one polyamide based on dimeric fatty acid, and at least one copolymer or terpolymer based on ethylene, a method for manufacturing the same, and a method for using the same to adhere plastics and metals.

Polymeric hotmelt adhesive

Thermoplastic polyamide resins showing improved substrate adhesion and consisting essentially of polycondensates of the following components:

Polyamide resin from dimer/trimer acid and N-alkyl diamine

Filling compounds having plastic flow behavior for electrical components and light-wave conductors comprising (a) a non-polar, water-immiscible hydrocarbon organic liquid, (b) an organic polymeric thickening agent therefor, (c) pyrogenic silica, and when used for electrical cables or optionally for optical cables, (d) hollow micro-bodies dispersed in the filling compounds.

Cable-filling compounds

The use of known thermoplastic polyamides based on dimerized fatty acids and predominantly aliphatic diamines, especially polyether diamines, as carriers for fragrances and perfumes.

Thermoplastic polyamide as fragrance carrier

A method for manufacturing sheathed high tensile strength optical waveguides having drawn glass fiber optical cores in which the cores are passed through a molten thermoplastic polyamide to form an adhering coating which is then cooled to form a uniform sheath. The sheath is flexible over a temperature range of -40.degree. C. to +80.degree. C. and the polyamide contains dimeric fatty acid as one of its monomer components and has a glass transition temperature below -10.degree. C.

Polyamide sheathed optical waveguide fibers

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Werner Gruber