Siemens Aktiengesellschaft

Werner Egerbacher

Dieter Wunderlich

Herbert Vogt

Werner Mitzkus

Heinz Martin

Semiconductor module, including a metallic bottom plate, at least two semiconductor bodies disposed on the bottom plate, at least one of the semiconductor bodies being a thyristor tablet having at least one control electrode, a frame having an inner surface, the frame being connected to the bottom plate and surrounding the semiconductor bodies, at least one control line for each thyristor tablet having first and second sections, each of the first sections being firmly connected to a respective one of the control electrodes and having an end facing away from the one control electrode, the ends each being adjacent the inner surface of the frame and including a contact region, each of the second sections being mechanically connected to the frame and having a contact region in contact with the contact region of a respective one of the first sections, and the second sections each including a contact terminal accessible from outside the module.

Semiconductor module

A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two plate type connecting bodies (3), between which lies a pressure-contacted semiconductor body (14). Both connecting bodies (3, 5) comprise radially and axially oriented seal surfaces (8, 9; 11, 12), against which there abuts under pressure an elastic ring (13) which surrounds the semiconductor body. The cup is filled with sealing compound (18); the semiconductor body is thus protected against penetration of the sealing compound.

Semiconductor element with disk-shaped housing

Semiconductor component with a disc-shaped case, including a ceramic ring having an inner surface, two metal discs, metal rings connecting the metal discs to the ceramic ring, a semiconductor body disposed in the case between the metal discs, an additional metal ring fastened to the periphery of each of the metal discs within the case, at least one electrically and thermally insulating foil having a high energy of evaporation disposed between the semiconductor body and the ceramic ring covering the inner surface of the ceramic ring and overlapping the additional metal rings.

Semiconductor component with a disc-shaped case

Semiconductor component includes a closed housing having a base and a cover and being formed with a plurality of recesses therewithin, a plurality of semiconductor elements received in the recesses, respectively, and having at least two poles, a plurality of contact strips heat-conductively connected to and electrically insulated from the housing base, one of the poles of each of the semiconductor elements being in contact with a respective one of the contact strips and therethrough being in heat-conductive contact with the housing base, a plurality of supply electrodes, respectively, connected to another of the poles of the respective semiconductor elements, the respective contact strip in contact with a respective pole of one of the semiconductor elements and the respective supply electrode connected to a respective pole of another of the semiconductor elements being electrically connected to one another, a cross-piece disposed in the housing between the recesses wherein the semiconductor elements are received, and means secured to the crosspiece for yieldably biasing the supply electrodes against the semiconductor elements, the contact strips and the contact electrodes extending out of the housing and forming terminals for the respective semiconductor elements.

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Munich, Germany

Werner Egerbacher