Infineon Technologies Ag

Wern Ken Daryl Wee

Chan Lam Cha

Chau Fatt Chiang

Norliza Morban

Si Hao Vincent Yeo

Khay Chwan Andrew Saw

Sock Chien Tey

Thorsten Meyer

Swee Kah Lee

Chee Hong Lee

Cher Hau Danny Koh

Fortunato Lopez

Hoe Jian Chong

Mei Yong Wang

Chin Kee Leow

Swee Kat Lee

Desmond Jenn Yong Loo

Ying Dieh Cheong

A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.

Semiconductor packages and methods for manufacturing thereof

A chip package includes a chip with at least one contact pad, a contact structure formed from at least one continuous longitudinally extended electrically conductive element by attaching the conductive element to the contact pad in at least three contact positions, wherein the conductive element bends away from the contact pad between pairs of consecutive contact positions, and an encapsulation partially encapsulating the contact structure, wherein the encapsulation includes an outer surface facing away from the chip, and wherein the contact structure is partially exposed at the outer surface.

Chip package and method of forming a chip package

A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.

Semiconductor package with metal posts from structured leadframe

A semiconductor package includes a substrate, a semiconductor die, dendrite, and a mold material. The substrate includes a die pad. The die pad includes roughening features. The semiconductor die is attached to the die pad such that the roughening features are adjacent to the semiconductor die. The dendrite is on the roughening features adjacent to the semiconductor die. The mold material encapsulates the semiconductor die, the dendrite, and at least a portion of the substrate.

Semiconductor packages including roughening features

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Melaka, Malaysia

Wern Ken Daryl Wee