University of Alberta

Wenzhen Sun

Douglas Gordon Ivey

A relatively stable, weakly acidic, non-cyanide electroplating solution for deposition of Au&mdash;Sn alloys over a range of compositions. The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and L-ascorbic acid as stabilizers. Preliminary electroplating experiments with the developed solution indicate that uniform, homogeneous deposits can be achieved over a range of compositions, including the technologically important eutectic and near euctectic values.

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Ottawa, Canada

Wenzhen Sun