Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Wenze Li

Cheng Zhang

Rongkun Fan

Shaopeng Li

Tianjun Deng

Weiben Zhang

Xiaolong Tang

Xinfeng Zhou

Junhao Ai

Lei Zhang

Yuan Liu

Ren Xiong

Tao Su

Dingjie Huang

Fakui Sun

Jianhua Shu

Hao Deng

Qiang Gou

A conductive adhesive film is disclosed. The conductive adhesive film includes a first film layer and a conductive particle layer. The first film layer has a plurality of electrode contact regions and a non-contact region separating the plurality of electrode contact regions. The first film layer has a plurality of gap structures, and the plurality of gap structures are located at least in the non-contact region. The conductive particle layer is located on a side of the first film layer. The conductive particle layer includes conductive particles. An orthographic projection of the conductive particles on the first film layer overlaps with at least a portion of each electrode contact region.

Conductive adhesive film and fabrication method therefor, electronic device and manufacture method therefor

A bending apparatus includes a fixing structure, a first driving mechanism, a first pressing head connected to the first driving mechanism, a second driving mechanism and a second pressing head connected to the second driving mechanism. The first driving mechanism is configured to drive the first pressing head to move onto a first surface of a first portion, and to drive the first pressing head to push the first portion to rotate to a first side of a body portion, so that the first portion is parallel or substantially parallel to the body portion. The second driving mechanism is configured to drive the second pressing head to move onto a second surface of a second portion, and is further configured to drive the second pressing head to pull the second portion to rotate to the first side of the body portion while the first pressing head pushes the first portion.

Bending apparatus, device to be bent and machining method therefor, bent device, and display device

Provided is a display panel. The display panel includes a drive backplane and a stress absorbing layer. The drive backplane includes a pixel circuit region and a peripheral region disposed outside the pixel circuit region, the peripheral region including a bending region; wherein the bending region and the pixel circuit region are sequentially arranged along a first direction, and the bending region is provided with at least one isolation trench arranged along a second direction, the at least one isolation trench extend through the drive backplane. The stress absorbing layer includes a plurality of absorbing portions, at least one of the plurality of absorbing portions being provided on both sides of each of the at least one isolation trench.

Display panel, method for manufacturing same, and display device with improved stress absorbing capacity

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Beijing, China

Wenze Li