Boe Technology Group Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

Wenqian Luo

Yingwei Liu

Zhiwei Liang

Zhanfeng Cao

Ke Fei Wang

Zhijun Lv

Guoqiang Wang

Xue Dong

Qi Yao

Guangcai Yuan

Haixu Li

Huijuan Wang

Jing Li

Zhanchang Bu

Feng Wang

Muxin Di

Shengguang Ban

Qingzhao Liu

Shibo Jiao

The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.

Supporting backplane, manufacturing method therefor and backplane

Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Display backplate and method for manufacturing same, display panel and method for manufacturing same, and display device

The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.

Driving substrate and manufacturing method thereof, and micro LED bonding method

The manufacturing method of the driving backplane includes following steps. A first flexible base is formed on a surface of a rigid substrate. At least one type of conductive pattern is formed on a surface of the first flexible base. At least one type of first via is provided in the rigid substrate. At least one type of second via is provided in the first flexible base by using the rigid substrate as a mask and a conductive pillar is formed in the at least one type of second via, so that the conductive pillars are connected to respective types of conductive pattern in one-to-one correspondence. At least one type of driving chip is correspondingly bonded to the conductive pillar formed in the at least one type of second via from a side of the first flexible base away from the at least one type of conductive pattern.

Driving backplane, manufacturing method thereof, and display apparatus

A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.

Backplane, preparation method with dual damascene steps

A display substrate includes a drive substrate and a welding pad provided on the drive substrate and electrically connected with the drive substrate. The display substrate further includes an insulating construction layer provided on the welding pad. The insulating construction layer is provided with a groove for exposing the welding pad. A bonding material is accommodated in the groove, and a micro light emitting diode is electrically connected with the welding pad through the bonding material.

Display substrate, preparation method thereof, and display device

The present disclosure provides a detection device for Micro-LED and a method manufacturing thereof, and a detection apparatus for Micro-LED, and the detection device for Micro-LED comprises: a substrate, and a first via and a second via penetrating through the substrate; the substrate comprises a first surface and a second surface which are opposite to each other; the first via and the second via are respectively arranged corresponding to a first pole and a second pole of a Micro-LED to be detected, and the detection device for Micro-LED further comprises: a first detection component and a second detection component on the first surface of the substrate.

Detection device for micro-LED and manufacturing method thereof, and detection apparatus for micro-LED

A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.

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Beijing, China

Wenqian Luo