Tesla, Inc.

Galatech, Inc.

Telsa Motors, Inc.

Wenjun Liu

Robert James Ramm

Colin Cameron Campbell

Dino Sasaridis

Colin Kenneth Campbell

Alan D Tepe

A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.

Inverter

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

Semiconductor device with stacked terminals

A method of fabricating a stator for an electric motor is provided. The method includes providing a plurality of stator laminations. Each stator lamination of the plurality of stator laminations is a copy of the same stator lamination pattern. The method further includes stacking the plurality of stator laminations in a sequence along an axis, comprising periodically varying rotational orientations of the stator laminations in the sequence. The method further includes joining the plurality of stator laminations as stacked in the sequence.

Methods and systems for stator cooling

The various implementations described herein include inverter devices and systems. In one aspect, an inverter includes: a case; a capacitor within the case having a first terminal and a second terminal; a first bus bar including a first portion within the case and a second portion extending from the case to contact a first transistor; a second bus bar including a first portion situated in the case and a second portion extending from the case to contact a second transistor; and a phase-out bus bar including a first portion situated in the case, a second portion extending from the case to contact the first transistor, and a third portion extending from the case to contact the second transistor.

Inverter capacitor with phase-out bus bar

A powertrain for an electric vehicle includes a casting that houses an electric motor, an inverter, and a gearbox. The inverter, which is coupled to the electric motor, converts direct current from a battery to alternating current for the electric motor. The gearbox is connected to the electric motor. The electric motor includes a stator and a rotor with a rotor shaft that extends beyond the stator. The inverter may be situated on an opposite side of the rotor shaft from an axle to which the gearbox is coupled.

Casting for motor and gearbox with integrated inverter

A semiconductor device includes housing, a substrate, a first semiconductor die, a second semiconductor die, a first terminal, and a second terminal. The first terminal in a first terminal plane couples to the first semiconductor die. The second terminal has a contact portion in a contact portion plane within the housing that couples to the second semiconductor die, a main portion in a main portion plane partially within the housing, the main portion plane substantially parallel to and offset from the first terminal plane, and the main portion plane substantially parallel to and offset from the contact portion plane, and an offsetting portion within the housing and that connects the contact portion to the main portion. At least some of the main portion of the second terminal overlaps the first terminal and the first terminal and the main portion of the second terminal extend from the housing in a same direction.

A packaged semiconductor device has a plurality of leads. A respective lead is to be welded to an electrical coupling that has a substantially rectangular end section. The end section has a width that is greater than a width of the respective lead. The respective lead is aligned within the width of the end section, such that the respective lead extends in a direction substantially perpendicular to the width of the end section. With the respective lead and the end section aligned, the respective lead is welded to the end section.

Weld joint with constant overlap area

A busbar locating component includes: one or more first attachments configured for attaching a busbar layer to the busbar locating component; one or more bays each configured to contain and position an assembly of transistors essentially perpendicular to the busbar layer for connection; and a plurality of slots, each slot configured to contain and position a busbar relative to the busbar layer for connection.

Busbar locating component

A heatsink with an internal cavity for liquid cooling includes: a first part having a first group of fins extending into the internal cavity; a second part attached to the first part so that the internal cavity is formed, the second part having a second group of fins that extend into the internal cavity and that are configured to fit among the first group of fins; an inlet into the internal cavity on at least one of the first and second parts; and an outlet from the internal cavity on at least one of the first and second parts.

Heatsink with internal cavity for liquid cooling

In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.

Welding and soldering of transistor leads

An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.

Growing community of inventors

Santa Clara, CA, United States of America

Wenjun Liu