Sun Microsystems, Inc.

Wenjun Chen

William W Ruckman

Anthony Kozaczuk

David K Kim

David J Kim

Talal Ahwal

David Kwang Jae Kim

David Kj Kim

Anthony R Fredericksson

Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.

Computer system layout and cooling configuration

A method and apparatus for providing an EMI seal in a system chassis. The EMI seal is provided by a bezel assembly for a storage medium drive. The bezel assembly includes a front bezel having an aperture through which a tray can extend for loading and unloading of the storage medium drive, and a tray bezel attached to the tray. Attached to the front bezel is an electrically conductive link. Both the front bezel and the tray bezel include an electrically conductive inner surface. Upon closing the tray, the electrically conductive link provides an electrical connection between the inner surface front bezel and the inner surface of the tray bezel.

EMI seal for system chassis

According to one embodiment, a computer system is disclosed. The computer system includes an enclosure and a card retaining assembly. The card training assembly is mounted within the enclosure to support printed circuit boards (PCBs). The card retaining assembly includes a housing, mounted within the enclosure that has one or more cavities. In addition, the card retaining assembly includes one or more retaining devices configured to be inserted into the one or more cavities in order to support the PCBs

Modular spring loaded PCI card retaining device

An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.

Integrated circuit chip test adapter

The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment of the present invention is an electro-magnetic interference shielding apparatus for an electronic assembly comprising a shielding partition that separates a first compartment from a second compartment. The apparatus further comprises a top enclosure capable of engaging with the shielding partition to form a plurality of contact seams. The contact seams are capable of restricting electro-magnetic interference from passing through the shielding apparatus. The top enclosure can be capable of tool-free installation and removal to provide access to the interior of the electronic assembly.

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Fremont, CA, United States of America

Wenjun Chen