Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Chinese Academy of Medical Sciences

Beijing Boe Technology Development Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Hefei Boe Ruisheng Technology Co., Ltd.

Wenjie Xu

Xiaodong Xie

Min He

Jing Wang

Xinxiu Zhang

Huayu Sang

Xue Liang Zhao

Tengfei Zhong

Bin Pang

Weiwei Chu

Dong Li

Yuan Li

Tsungchieh Kuo

Tianyu Zhang

Lijun Hao

Jingyuan Song

Tianyi Xin

Feifei Yu

Guihong Qi

Jian Li

Jin Zhang

Jie Wang

Zouming Xu

Yuan Yuan Li

Jian Tian

Chunjian Liu

Xintao Wu

Jie Lei

Qin Zeng

Guilin Liu

Yaying Li

Xiujuan Cui

Jingjing Li

Qiang Ji

Yutong Gan

An array substrate includes: a substrate, a first conductive layer, a second conductive layer and at least two organic insulating layers; the first conductive layer is provided on a side of the substrate; the second conductive layer is provided on a side of the first conductive layer away from the substrate, and an orthographic projection of the second conductive layer on the substrate has an overlapped region with an orthographic projection of the first conductive layer on the substrate, the overlapped region includes a via region and a routing region; the at least two organic insulating layers are provided between the first conductive layer and the second conductive layer, and an orthographic projection of the at least two organic insulating layers on the substrate is overlapped with an orthographic projection of the routing region.

Array substrate, method for manufacturing array substrate and display device

Disclosed in the present application are a method for identifying the species of a eukaryotic sample on the basis of whole genome analysis, and the use thereof, wherein the species identification of a sample to be detected is achieved by means of a species-specific target sequence obtained by screening. The species identification method of the present invention has good specificity, high sensitivity and good repeatability, and can achieve rapid species identification without relying on large-scale professional instruments.

Method for identifying species of eukaryote on basis of whole genome analysis, and use thereof

A method for identifying plant species based on whole genome analysis and genome editing, i.e., a GAGE, includes that screening PAM-carrying sequences from a whole genome of a plant to be identified; aligning the PAM-carrying sequences with genomes of counterfeit species and closely related species, and then selecting sequences that are only present in the genome of the plant to be identified as target sequences; and performing a detection on the target sequences as selected by introducing a genome editing system, wherein based on the target sequences as selected, a CRISPR RNA (crRNA), which acts to guide a Cas protein to bind with a target sequence to form a complex, is designed and synthesized; then the trans-cleavage activity of the Cas protein is activated so that a single strand DNA bearing a fluorescent signal group is cleaved; and the plant species is identified by detecting the fluorescent signal.

Method and use for identifying plant species based on whole genome analysis and genome editing

A driving backplane, a manufacturing method thereof, a light-emitting substrate are provided. In the driving backplane, a first conductive layer on a substrate; a first organic film layer is between the first conductive layer and second conductive layer, the first organic film layer has first via holes; a first inorganic film layer is on one side of first organic film layer away from the substrate; the second conductive layer is on one side of first inorganic film layer away from first organic film layer, the second conductive layer and the first conductive layer are connected through the first via holes; orthographic projections of the first conductive layer and second conductive layer have an overlapping region, the overlapping region includes a region including orthographic projection of the first via holes, and a first region, an orthographic projection of the first inorganic film layer covers parts of the first region.

Driving backplane, manufacturing method thereof, and light-emitting substrate

A touch substrate () and a touch display device. The touch substrate () includes: a base substrate (); a plurality of first touch electrodes () located on the base substrate (); a plurality of second touch electrodes () located on a side, facing away from the base substrate (), of a layer where the first touch electrodes () are located and insulated from the first touch electrodes (); and a plurality of floating electrodes () insulated from the plurality of first touch electrodes () and the plurality of second touch electrodes (), and arranged on the same layer as at least one of the first touch electrodes () or the second touch electrodes (). Each floating electrode () has a grid shape, and at least part of the floating electrodes () is disconnected at at least part of dots.

Touch substrate and touch display device with disconnected dots

The present disclosure provides a touch substrate having a touch electrode area and a peripheral area surrounding the touch electrode area. The touch substrate includes: a touch electrode layer in the touch electrode area and an electrostatic release structure in the peripheral area. The touch electrode layer includes touch electrodes and dummy electrodes alternately arranged along a first direction and separated from each other, the touch electrodes and the dummy electrodes extend along a second direction intersecting the first direction, the touch electrodes and the dummy electrodes both are conductive mesh structures, and the dummy electrode has a first end and a second end along the second direction and includes at least one conductive path that is continuous between the first end and the second end. The at least one conductive path is electrically connected to the electrostatic release structure.

Touch substrate, manufacturing method thereof and touch device

The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.

Thin film sensor and method for preparing the same

An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Array substrate, light-emitting substrate and display device

A light emitting substrate () and a display device are provided. The light emitting substrate () includes a light emitting region () and a border region (). The light emitting substrate () includes a base (), and a plurality of light emitting units () and a plurality of signal lines () located on the base (). The light emitting units () are located in the light emitting region (), and each includes a driving circuit () and at least one light emitting element (). The plurality of light emitting units () are arranged into M rows along a first direction (D) and into N columns along a second direction (D) intersecting the first direction (D). The plurality of signal lines () include N target signal lines () extending along the first direction (D); the border region () includes a region of the light emitting substrate () located outside a first column of light emitting units (), a region of the light emitting substrate () located outside an Ncolumn of light emitting units (), and a region of the light emitting substrate () located outside a first row of light emitting units. A target signal line () for the first column of light emitting units () and/or the Ncolumn of light emitting units () include(s) a first extension section (), a connection section () and a second extension section () connected in sequence. The first extension section () is connected with a driving circuit () and located in the border region (). The first extension section (), the connection section () and the second extension section () enclose a receiving region surrounding at least two groups of light emitting units ().

Light emitting substrates and display devices

Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0&#x3c;x&#x2264;y.

Driving backplane and method for manufacturing the same, and display device

Disclosed are a touch substrate and a preparation method thereof, and a touch apparatus. The touch substrate includes an electrostatic transmission layer, a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer which are sequentially stacked, wherein the first conductive layer includes a first touch electrode, the second conductive layer includes a second touch electrode and a second dummy electrode which are insulated from each other, and the second dummy electrode is electrically connected to the electrostatic transmission layer by means of a via penetrating the first insulating layer and the second insulating layer; and/or, the first conductive layer further includes a plurality of first dummy electrodes insulated from one another, and the first dummy electrode and the first touch electrode are insulated from each other.

Touch substrate, touch apparatus and method of preparation with dummy electrode connected to electrostatic transmission layer

Provided are a touch substrate, a preparation method thereof and a touch device. The touch substrate includes a substrate, and a first conductive layer, a first insulating layer and a second conductive layer sequentially stacked on the substrate. The first conductive layer includes a first capacitive touch electrode, a first wiring and a second wiring. The first wiring is electrically connected to the first capacitive touch electrode, and the second wiring is insulated from the first capacitive touch electrode. The first insulating layer includes at least one first via. The second conductive layer includes a second capacitive touch electrode, which is electrically connected to the second wiring through the first via. The second conductive layer further includes an additional functional channel, which is insulated from the second capacitive touch electrode.

Touch substrate and preparation method thereof, and touch device

A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.

Backplane and manufacturing method thereof, backlight module, and display panel using micro light-emitting diodes

The present disclosure provides a display substrate, a method for manufacturing the same and a display device. The display substrate includes a base substrate, first wires on a side of the base substrate, a first barrier layer on the side of the base substrate; and a second wire on a side of the first barrier layer distal to the base substrate, where the first wires and the second wire being adjacent to and spaced apart from each other.

Display substrate, method for manufacturing the same, and display device

A method of forming a touch control module, a touch control module, and a touch display device are provided. The method includes: providing a rigid base substrate; forming a base layer on the rigid base substrate; forming a touch functional layer at a side of the base layer away from the rigid base substrate; separating the rigid base substrate from the base layer, to form a touch functional component including the base layer and the touch functional layer; and adhering the touch functional component to a display functional component of a display device through an adhesive, to form the touch control module.

Growing community of inventors

Beijing, China

Wenjie Xu