Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Wenhua Zhang

Jiangbo Ouyang

John Gregory Woods

Bahram Issari

Shengqian Kong

Yayun Liu

Stephen Hynes

Chunyu Sun

Robert P Cross

Lynnette M Hurlburt

Qinyan Zhu

Hong Jiang

Darel L Gustafson

Rudolf Oldenzijl

Inge Van Der Meulen

Mark Jason

Yu Chen

Li Kang

Xiaoyan Huang

Xiao Allison Yue

Hong (Dorothy) Jiang

Zhan Yang

Junjun Wu

Xiao Alison Yue

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

Debondable compositions

Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.

Stretchable electrically conductive ink compositions

Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.

Provided herein are metal conductive compositions with improved conductivity. The improved conductivity is attributable to the addition of a sintering agent and a polymer emulsion.

Polymer emulsion as binder for conductive composition

Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Reactive resins and formulations for low refractive index and low dielectric constant applications

The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

1K UV and thermal cure high temperature debondable adhesive

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

High temperature debondable adhesive

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Farmington, CT, United States of America

Wenhua Zhang