Cmos Sensor, Inc.

Scan Vision Limited

Dyna Image Corporation

Cmos Senor, Inc.

Weng-Lyang Wang

Shengmin Lin

Hsin-Fu Tseng

Chi-Pin Lin

Long-Ching Yeh

Feng Ke Hsiao

Feng-Ke Hsiao

Yung Chau Yen

Way-Chen Wu

A multi-pixel row wafer-scale cluster image sensor chip (WCISC) is proposed. Expressed in X-Y-Z coordinates with its pixel rows along X-axis, the WCISC converts areal image frame (IMFM) into areal image frame signal (AIFS). The WCISC includes multiple imaging pixel rows PXRW, . . . , PXRW. Each PXRWhas photoelectrical sensing elements spanning pixel row width PRWand producing a pixel row image signal PRIS. Each PXRWis offset from PXRWby distance XOFSTand spaced from PXRWby distance SPsuch that X- and Y-extremities of (PXRW, . . . , PXRW) define IMFM. The WCISC is so configured that any image pixel sweeping through IMFM will be sensed by at least one imaging pixel row. In the presence of Y-directional relative motion between WCISC and IMFM and an external electronic imaging controller (EEIC) interfacing with the WCISC, the EEIC can extract all PRISfrom WCISC and reconstruct the AIFS.

Wafer-scale cluster image sensor chip and method with replicated gapless pixel line and signal readout circuit segments

A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length Linto line image signal (LIS). The WLISC includes a linear array of sensor segments. Each sensor segment includes a gapless local pixel line segment (LPLS) of sensing elements. The LPLSconverts portion of the PLI into a raw image segment signal set (RISS). The LPLSset forms a gapless global pixel line (GPL) corresponding to PLI. The sensor segment also includes readout circuit segment (RCS) coupled to LPLSfor processing RISSinto a readout image segment signal set (ROSS). The RCShas a set of contact pads (CTP) for off-chip interconnection. Upon off-chip interconnection of the CTPset thus composing the ROSSset into LIS, the WLISC functions as a key part of a linear image sensor system of image length L.

Wafer-scale linear image sensor chip and method with replicated gapless pixel line and signal readout circuit segments

A long-length industry camera image sensor (LICIS) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length Lalong X-direction into a line image signal (LIS). The LICIS includes a full-width linear image sensor (FLIS) of length Lalong X-direction and displaced from the PLI along Z-direction by an imaging distance Dfor converting an incident line image (ILI) impinging upon its FLIS top surface into the LIS. Where Lis about equal to L. The LICIS also has a full-width linear rod lens (FLRL) of length Lalong X-direction and displaced from the PLI in Z-direction by a working distance D. Where Lis about equal to Land Dis selected such that the PLI gets focused by the FLRL into the ILI at the FLIS top surface with an imaging magnification factor of about 1:1.

Long-length industry camera image sensor for flat surface inspection application

An areal active pixel image sensor (AAPS) with programmable row-specific gain is disclosed for converting hyper-spectral light image into video output signal (VOS). The AAPS includes: Consequently, the AAPS exhibits an overall photoelectric signal gain of GOA=GPE&#xd7;GEE that is row-specific and it can compensate for image signal distortion caused by non-uniform spectral response of the APS elements during hyper-spectral imaging.

Areal active pixel image sensor with programmable row-specific gain for hyper-spectral imaging

A multi-lightguide document imaging device is proposed for scanning a document transported atop it. The device includes a line image sensor module having a top sensing area and built-in circuitry for converting an incident line image into video signal output; an intervening rod lens for focusing line image lights from the document onto the sensing area; a number or lightguides lightguide-j (j=1,2, . . . ,N) disposed below the document where each lightguide-j has its own built-in light sources, a transverse cross section spaced at a distance SPCfrom the scan line an oriented angularly along a &#x3b8;-coordinate so as to project a line-illumination aiming at the scan line; and an imager frame having a base for holding the line image sensor module, a multi-element support for holding the rod lens plus the lightguides and a scan line backing portion for backing the document.

Multiple lightguide electronic document imaging device

A sensor chip with an on-chip operational amplifier is described for the formation into a sensor array of a Contact Image Sensor (CIS) module. A number of extra on-chip bonding pads are provided which are electrically connected to the operational amplifier, the associated input resistor and the charge integration capacitor in a selective manner. A number of extra off-chip common conductor stripes are also provided on the substrate for the chip array. A set of wiring patterns are then used to selectively connect these on-chip bonding pads with their corresponding off-chip common conductor stripes resulting in a CIS module which provides both a variable gain of a selected single operational amplifier and an equivalent charge integration capacitance which is the summation of the capacitors from the individual sensor chips within the chip array. Additionally, the associated input resistors can be replaced with an MOS transistor whose control gate can be similarly programmed with the wiring pattern.

Image sensor chip with an integrated operational amplifier and its application in a CIS module

An image sensor system having very long Depth Of Focus (DOF) on the document plane and very short optical distance from the document plane to the image plane provides the advantages of both a lens reduction image sensor system and a contact type image sensor system. The inventive image sensor system thus provides a Long depth of Focus Contact type Image Sensor (Lf-cis) system that can be assembled in a compact and light weight module that is suitable for use in current image scanning systems (for example, flatbed type, paper feeder type, and handheld type). The invention also provides a compact and light weight flatbed type image scanning system. The CIS module may be modified such that two ends of the module higher than the rest of the module, a steel bracket holds the module and maintains the optical path in alignment, and a metal carriage having metal spring holds the module. The CIS module is self aligned to the bottom of the scanner glass. No optical adjustment or mechanical adjustment is required on the scanner assembly line. A central guideway and a low power stepping motor are provided to drive the entire module.

Long depth of focus contact image sensor (LF-CIS) module for compact and

A contact image sensing system that eliminates the use of npn phototransistors. The device comprises a plurality of sensing elements, a like number of dummy sensing elements, control and drive clocks, a digital scanning shift register, and a differential amplifier. The device operates by sequentially reading the voltage output of the sensors, then comparing that output with the output of the dummy sensors so that any noise or offset in the signal can be cancelled by a differential amplifier.

Contact image sensor utilizing differential voltage pickoff

A color-reproducing contact image sensing (CORCIS) system that eliminates the use of multiple arrays of photodetectors with separate color filters and which permits the use of any of various signal-processing improvements such as voltage pickoff, transducer gain and correlated double sample and hold processing. The device operates by sequentially illuminating the colored object to be reproduced by primary color illumination means, with each illumination transferring in parallel the appropriate color response to a readout register for sequential readout. The sample and hold, and the parallel transfer operation, allow the CORCIS system to be able to read out signal while the detector array is integrating the next color signal, thus improving the sensitivity.

Full color single-sensor-array contact image sensor (CIS) using advanced

An improved contact image sensor (CIS) which uses a two-phase shift register is disclosed. The shift register is clocked by both phases of the clock signal, thereby doubling its speed. A transmission gate in the shift register is eliminated and combined with one of the inverters to allow two-phase operation and reduce the number of transistors required to implement the shift register.

Growing community of inventors

Saratoga, CA, United States of America

Weng-Lyang Wang