Freescale Semiconductor,inc.

Weng Hoong Chan

Boon Yew Low

Ly Hoon Khoo

Navas Khan Oratti Kalandar

A packaged integrated circuit (IC) device includes a flexible substrate having contact pads, an IC die mounted on the substrate and electrically connected to the contact pads, and conductive threads sewn into the substrate. The conductive threads have proximal ends electrically connected to corresponding ones of the contact pads with conductive bumps. The conductive threads eliminate the need for a complicated multi-layer substrate structure for interconnect fan-out so the substrate may be formed of a variety of materials such as cloth or paper.

Integrated circuit with sewn interconnects

A sub-assembly for a packaged integrated circuit (IC) device has a planar substrate. The substrate's top side has multiple sets electrically connected bond posts arranged in corresponding nested contour zones. Each contour zone includes a different bond post of each bond-post set. The bottom side has a different set of pad connectors electrically connected to the each top-side bond-post set. The sub-assembly can be used for different IC packages having IC dies of different sizes, with different contours of bond posts available for electrical connection depending on the size of the IC die.

Multi-use substrate for integrated circuit

A Quad Flat Pack (QFP) type semiconductor device includes four corner tie bars that, instead of being trimmed, are used for power and/or ground connections, and alternatively, to control mold flow during the encapsulation step of the assembly process.

Growing community of inventors

Petaling Jaya, Malaysia

Weng Hoong Chan