Oak-Mitsui Inc.

Wendy Herrick

John A Andresakis

Edward C Skorupski

Jeffrey T Gray

Jonathan Meigs

Michael D Woodry

A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated to a substrate such that the nickel layer is in contact with the substrate. The copper foil is removed, leaving the nickel layer on the substrate. Using photomechanical imaging and etching techniques known in the art, NiFe is plated and patterned directly on the nickel layer, thereby forming integral inductor cores of the substrate. This process of the present invention allows for the elimination of several steps used in known processes, while also reducing etch time and minimizing waste of NiFe.

Printed circuit boards having integrated inductor cores

The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.

Substrate adhesion enhancement to film

The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.

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Clifton Park, NY, United States of America

Wendy Herrick