Honeywell International Inc.

Norton Company

Wendy A Herrick

Gary J Kardys

Derek Carbin

A method of forming circuit lines on a substrate by applying a roughened conductive metal layer using a copper foil carrier. The copper foil is etched away, leaving the roughened conductive metal embedded in the surface of the substrate. The conductive metal may be treated to remove an oxide layer. A photoresist may also be applied over the treated conductive metal layer to define a fine line circuit pattern. The photoresist defining the fine line circuit pattern is then removed to expose trenches in accordance with the desired circuit pattern. Copper is applied into the trenches over the exposed conductive metal, and the remaining photoresist, and conductive metal underlying the remaining photoresist, is removed to finish the fine line circuit pattern.

Method for forming conductive traces and printed circuits made thereby

Coated abrasive materials can be made from a backing material with abrasive particles adhered to the backing through an orienting layer in the form of a mesh of a size and dimensions to ensure that the orientation of the grits substantially perpendicular to the coating material is maintained.

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Clifton Park, NY, United States of America

Wendy A Herrick