Corning Incorporated

Wenchao Wang

David Myron Lineman

Kevin Thomas Morris

Kim E Womer

Kristen Marie Horn

Jill Marie Hall

William Brashear Mattingly, Iii

Rui Zhang

Randy Dean Ziegenhagen

Dale Madard Fisher, Jr

Jean-Marc Martin Gerard Jouanno

Nicholas Scott Ryan

Jianqiang Gu

Yoshiki Yamashita

Elizabeth Mary Sturdevant

An frit-sealed device comprising a resistive heating element having an electrically-closed-loop structure and process for frit-sealing a device by using such heating element. The element can be advantageously made of a metal such as Invar&#xae; and/or Kovar&#xae;. The invention enables hermetic frit sealing with low residual stress in the seal. The invention is particularly advantageous for hermetic sealing of OLED display devices.

Frit sealing using direct resistive heating

A mold for shaping glass-based material can include a mold body having a surface, wherein at least a portion of the mold body near the surface comprises at least about 90% by weight nickel and from about 0.2% to about 0.35% by weight manganese; and a nickel oxide layer on the surface of the mold body. The nickel oxide layer has first and second opposing surfaces wherein the first surface of the nickel oxide layer contacts and faces the surface of the mold body and the second surface of the nickel oxide layer includes a plurality of grains. The plurality of grains has an average grain size of about 150 &#x3bc;m or less.

Molds for shaping glass-based materials and methods for making the same

A mold for shaping glass can be made by a method that includes providing a mold body having a shaping surface comprising at least about 90% nickel and modifying the composition of the shaping surface of the mold body by exposing the shaping surface to an oxidizing heat treatment. The oxidizing heat treatment may include a ramping heat treatment, a fixed heat treatment, or both the ramping heat treatment and the fixed heat treatment. The ramping heat treatment may include increasing a heating temperature at a rate from about 20&#xb0; C./hour to about 500&#xb0; C./hour to a temperature from about 700&#xb0; C. to about 1000&#xb0; C. The fixed heat treatment may include holding the heating temperature from about 700&#xb0; C. to about 1000&#xb0; C. for a holding time of at least about 5 minutes.

Molds for shaping glass and methods for making the same

Methods provide for post processing at least one flexible glass sheet with the step of providing the glass sheet with an initial shape. The method then further includes the step of flexing the glass sheet into a secondary shape from the initial shape. The method then further includes the step of post processing the glass sheet while biasing the glass sheet into the secondary shape. The method then still further includes the step of releasing the glass sheet to at least partially return to the initial shape.

Methods of post processing a glass sheet

The present disclosure relates to high purity nickel molds for use in forming three dimensional glass substrates, along with methods of making three dimensional glass substrates. The mold compositions minimize imperfections in the formed glass substrates providing optical quality shaped glass articles for use in electronics applications.

High purity nickel molds for optical quality glass forming

A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Method for bonding refractory ceramic and metal

A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heating element can be advantageously made of a metal such as Invar&#xae; and/or Kovar&#xae;. The invention enables hermetic frit sealing with low residual stress in the seal for large-area displays. The invention is particularly advantageous for hermetic sealing of OLED display devices having a large area, such as those above 10 inches (25 cm).

Frit sealing of large device

A mandrelincludes a top support, a first edge support, a bottom support, and a second edge support. The top support and first edge support make-up a first support section. The bottom support and second edge support make-up a second support section. The first support section and the second support section are disposed relative to one another so as to form an outer circumference. A jackis coupled to the first and second support sections and is configured to move the first and second support sections relative to one another so as to adjust the outer circumference of the mandrel. A locking elementremovably is coupled to the first and second support sections to selectively prevent relative movement between the first and second support sections.

Growing community of inventors

Ithaca, NY, United States of America

Wenchao Wang