Western Digital Technologies, Inc.

Stats Chippac Pte. Ltd.

Wenbin Qu

Chin-Tien Chiu

Yazhou Zhang

Jiandi Du

Binbin Zheng

Sundarraj Chandran

JaeHak Yee

Junwei Hu

Lin Tan

YuFeng Feng

A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.

Thermoelectric semiconductor device and method of making same

A semiconductor device has a flipchip semiconductor die mounted to a first substrate using a plurality of first bumps. An opening or plurality of openings is formed in the first substrate in a location central to placement of the flipchip semiconductor die to the first substrate. A plurality of semiconductor die is mounted to a second substrate. The semiconductor die are electrically connected with bond wires. An encapsulant is over the plurality of semiconductor die and second substrate. The second substrate is mounted to the first substrate with a plurality of second bumps. An underfill material is dispensed through the opening in the first substrate between the flipchip semiconductor die and first substrate. The dispensing of the underfill material is discontinued as the underfill material approaches or reaches a perimeter of the flipchip semiconductor die to reduce bleeding of the underfill material. The underfill material is cured.

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

Growing community of inventors

Shanghai, China

Wenbin Qu